Polymer Property : Tensile Modulus = 312 ksi Product List

Mechanical Properties

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Mechanical Properties	Metric	English	Comments
Tensile Modulus	2.15 GPa	312 ksi	5 mm/min; ASTM D638
SABIC Innovative Plastics Cycoloy® CY100FC PC+ABS (Asia Pacific) High impact PC+ABS material designed for local Pacific Automotive applications
Tensile Modulus	2.15 GPa	312 ksi	1 mm/min; ISO 527
SABIC Innovative Plastics Lexan® 1173X PC Copolymer (Europe-Africa-Middle East) Lexan* 1173X polycarbonate (PC) resin is a high flow, UV stabilized injection molding grade. This resin offers good low temperature (-30 C) ductility in combination with high flow characteristics an..
Tensile Modulus	2.15 GPa	312 ksi	1 mm/min; ISO 527
SABIC Innovative Plastics Lexan® 4401R PPC+PC LEXAN 4401R is a high heat resistant poly(ester)carbonate injection molding resin.This data was supplied by SABIC-IP for the Americas region.
Tensile Modulus	2.15 GPa	312 ksi	1 mm/min; ISO 527
SABIC Innovative Plastics Lexan® 4404 PPC+PC High heat polycarbonate copolymer, with HDT of 287F at 264 psi. FDA food contact compliant. Effective Jan 15th, 2008 this grade should not be used for medical applications which require biocompatibi..
Tensile Modulus	2.15 GPa	312 ksi	1 mm/min; ISO 527
SABIC Innovative Plastics Lexan® 4404 PPC+PC (Asia Pacific) High heat polycarbonate copolymer, with HDT of 287F at 264 psi. FDA food contact compliant. Effective Jan 15th, 2008 this grade should not be used for medical applications which require biocompatibi..
Tensile Modulus	2.15 GPa	312 ksi	1 mm/min; ISO 527
SABIC Innovative Plastics Lexan® EXL1112 PC Copolymer (Asia Pacific) Lexan* EXL1112 polycarbonate (PC) siloxane copolymer resin is a high flow opaque injection molding (IM) grade. This resin offers good low temperature (-20 C) ductility in combination with excellent ..
Tensile Modulus	2.15 GPa	312 ksi	1 mm/min; ISO 527
SABIC Innovative Plastics Lexan® EXL1132 PC Copolymer (Asia Pacific) Lexan* EXL1132 polycarbonate (PC) siloxane copolymer resin is a high flow, UV stabilized injection molding grade. This resin offers good low temperature (-20 C) ductility in combination with high fl..
Tensile Modulus	2.15 GPa	312 ksi	1 mm/min; ISO 527
SABIC Innovative Plastics Lexan® EXL1414 PC Copolymer Lexan* EXL1414 polycarbonate (PC) siloxane copolymer resin is a medium flow opaque injection molding (IM) grade. This resin offers extreme low temperature (-40 C) ductility in combination with excel..
Tensile Modulus	2.15 GPa	312 ksi	1 mm/min; ISO 527
SABIC Innovative Plastics Lexan® EXL1434 PC Copolymer Lexan* EXL1434 polycarbonate (PC) siloxane copolymer resin is a medium flow opaque injection molding (IM) grade and is UV stabilized. This resin offers extreme low temperature (-40 C), exhibits exce..
Tensile Modulus	2.15 GPa	312 ksi	1 mm/min; ISO 527
SABIC Innovative Plastics Lexan® EXL1444 PC Copolymer Lexan* EXL1444 polycarbonate (PC) siloxane copolymer resin is a medium flow opaque injection molding (IM) grade suitable for FDA compliant applications. This resin offers extreme low temperature (-..
Tensile Modulus	2.15 GPa	312 ksi	1 mm/min; ISO 527
SABIC Innovative Plastics Lexan® EXL1444 PC Copolymer (Asia Pacific) Lexan* EXL1444 polycarbonate (PC) siloxane copolymer resin is a medium flow opaque injection molding (IM) grade suitable for FDA compliant applications. This resin offers extreme low temperature (-..
Tensile Modulus	2.15 GPa	312 ksi	50 mm/min; ASTM D638
SABIC Innovative Plastics Lexan® EXL8414 PC Copolymer Lexan* EXL8414 is a PC/siloxane copolymer resin with medium flow, excellent low temperature impact and up to 25% post consumer recycle content. Availability of resin is restricted and lead times are..
Tensile Modulus	2.15 GPa	312 ksi	1 mm/min; ISO 527
SABIC Innovative Plastics Lexan® FXD9810 PC Copolymer Non-chlorinated, non-brominated Flame retardant PC-siloxane copolymer blend. Excellent processability, super high flow, good impact, UL rated V-0. Limited translucent colors.
Tensile Modulus	2.15 GPa	312 ksi	1 mm/min; ISO 527
SABIC Innovative Plastics Lexan® FXD9810 PC Copolymer (Asia Pacific) Non-chlorinated, non-brominated Flame retardant PC-siloxane copolymer blend. Excellent processability, super high flow, good impact, UL rated V-0. Limited translucent colors.
Tensile Modulus	2.15 GPa	312 ksi	1 mm/min; ISO 527
SABIC Innovative Plastics Lexan® FXE1414 PC Copolymer Lexan* FXE1414 polycarbonate (PC) siloxane copolymer resin is a special effects fluorescent, medium flow opaque injection molding (IM) grade. This resin offers extreme low temperature (-40 C) ductil..
Tensile Modulus	2.15 GPa	312 ksi	1 mm/min; ISO 527
SABIC Innovative Plastics Lexan® HFD1232 PC Copolymer 18 MFR LEXAN High Flow Ductile Copolymer UV-stabilized, available in transparent colors only
Tensile Modulus	2.15 GPa	312 ksi	1 mm/min; ISO 527
SABIC Innovative Plastics Lexan® HFD1262 PC Copolymer (Europe-Africa-Middle East) 19 MFR LEXAN High Flow Ductile Copolymer with 400 nm cut off, available in transparent colors only
Tensile Modulus	2.15 GPa	312 ksi	1 mm/min; ISO 527
SABIC Innovative Plastics Lexan® ML7647 PC (Asia Pacific) Non FR Impact modified PC, excellent Fatigue performance with balanced Flow and impact. Available in Opaque only
Tensile Modulus	2.15 GPa	312 ksi	50 mm/min; ASTM D 638
SABIC Innovative Plastics Lexan® ML7666 PC (Asia Pacific) Non FR Impact modified PC, excellent Fatigue performance with balanced Flow and impact. Available in Opaque onlyThis data was supplied by SABIC-IP for the Asia Pacific region.
Tensile Modulus	2.15 GPa	312 ksi	1 mm/min; ISO 527
SABIC Innovative Plastics Lexan® ML7689 PC Copolymer (Europe-Africa-Middle East) Lexan* ML7689 polycarbonate (PC) siloxane copolymer resin IS a high viscosity injection molding (IM) grade WITH good processability, offering opportunities FOR shorter IM CYCLE times compared TO sta..
Tensile Modulus	2.15 GPa	312 ksi	1 mm/min; ISO 527
SABIC Innovative Plastics Lexan® EXL1414H PC Copolymer (Europe-Africa-Middle East) Opaque PC-Siloxan copolymer with excellent processability. Medium flow, extreme low temperature ductile. Enhanced hydrolytic stability. Only available in black color.
Tensile Modulus	2.15 GPa	312 ksi	50 mm/min; ASTM D638
SABIC Innovative Plastics Lexan® EXL9330S PC Copolymer (Asia Pacific) Opaque PC-Siloxane copolymer with excellent processability. UV stabilized. UL rated V-0/5VA/CTI-PLC-2. Available in limited colors.
Tensile Modulus	2.15 GPa	312 ksi	1 mm/min; ISO 527
SABIC Innovative Plastics Lexan® FXD9810 PC Copolymer (Europe-Africa-Middle East) Non-chlorinated, non-brominated Flame retardant PC-siloxane copolymer blend. Excellent processability, super high flow, good impact, UL rated V-0. Limited translucent colors.This data was supplied b..
Tensile Modulus	2.15 GPa	312 ksi	1 mm/min; ISO 527
SABIC Innovative Plastics Lexan® HFD1212 PC Copolymer (Asia Pacific) 18 MFR LEXAN High Flow Ductile Copolymer
Tensile Modulus	2.15 GPa	312 ksi	5 mm/min; ASTM D 638
SABIC Innovative Plastics XenoyÂ® X3515 PC+POLYESTER (Asia Pacific) Flame Retardant, Impact Modified, Opaque, Designed for outdoor telecommunication enclosure applications.This data was supplied by SABIC-IP for the Asia Pacific region.
Tensile Modulus	2.15 GPa	312 ksi	5 mm/min; ASTM D 638
SABIC Innovative Plastics XenoyÂ® X3515 PC+POLYESTER (Europe-Africa-Middle East) Flame Retardant, Impact Modified, Opaque, Designed for outdoor telecommunication enclosure applications.This data was supplied by SABIC-IP for the Europe-Africa-Middle East region.
Tensile Modulus	2.15 GPa	312 ksi	50 mm/min; ASTM D638
SABIC Innovative Plastics LNP STAT-LOY NX03583 PC+ABS LNP STAT-LOY* NX03583 is a compound based on PC+ABS Blend resin. Added features of this material include: Antistat, Flame Retardant.
Tensile Modulus	2.15 GPa	312 ksi	Storage
Epoxy Technology EPO-TEK® E2001-HV Electrically Conductive, Silver-Filled Epoxy Product Description: EPO-TEK® E2001-HV Is a snap cure, two component, silver-filled die attach adhesive for semiconductor plastic IC packaging.Advantages & Application Notes:Snap cure adhesive or f..
Tensile Modulus	2.15 GPa	312 ksi	Storage
Epoxy Technology EPO-TEK® E3001-HV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & ..
Tensile Modulus	2.15 GPa @Temperature 23.0 °C	312 ksi @Temperature 73.4 °F	DAM; ISO 527
DuPont Performance Polymers Zytel® HTN FE8200 BK431 Polyphthalamide (PPA) (Unverified Data**) Zytel® HTNFE8200 BK431 is an unreinforced, toughened, heat stabilized, lubricated high performance polyamide resin for injection molding. It is also a PPA resin.Information provided by DuPont Perfo..