Mechanical Properties | Metric | English | Comments |
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Compressive Modulus | 1.55 GPa | 225 ksi | ASTM D695 |
Quadrant EPP Fluorosint® 207 PTFE, Compression Molded Synthetic Mica-filled PTFE (ASTM Product Data Sheet) |
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Compressive Modulus | 1.55 GPa | 225 ksi | ASTM D3410 |
Arlon CLTE Microwave Printed Circuit Board Substrate CLTE is a ceramic powder-filled and woven micro fiberglass reinforced PTFE composite engineered to produce a stable, low water absorption laminate with a nominal Dielectric Constant of 2.98.Ceramic/.. |
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Compressive Modulus | 1.55 GPa | 225 ksi | ASTM D695 |
Arlon CLTE-P Pre-Preg Bonding Layer Arlon's CLTE-P Prepreg Bonding Layer is a ceramic filled PTFE coated glass stock that is used as a bonding ply for CLTE, CLTE-X or CLTE-AT laminates. CLTE-P is a pre-preg material that consists of .. |
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Compressive Modulus | 1.55 GPa | 225 ksi | ASTM D695 |
Quadrant EPP Semitron® ESd 500 HR PTFE, static dissipative, compression molded (ASTM Product Data Sheet) |