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Arlon CLTE-P Pre-Preg Bonding Layer

Category Polymer , Thermoplastic , Fluoropolymer , PTFE
Manufacturer Arlon
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Arlon CLTE-P Pre-Preg Bonding Layer.pdf
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Material Notes:
Arlon's CLTE-P Prepreg Bonding Layer is a ceramic filled PTFE coated glass stock that is used as a bonding ply for CLTE, CLTE-X or CLTE-AT laminates. CLTE-P is a pre-preg material that consists of woven fiberglass fabric coated with a proprietary resin formulation. The Proprietary resin is thermoplastic, not thermoset in nature.Information provided by Arlon Materials for Electronics (MED).
Physical Properties Metric English Comments
Density 2.38 g/cc
0.0860 lb/in³
ASTM D792 Method A
Water Absorption 0.040 %
0.040 %
IPC TM-650 2.6.2.2
Thickness 0.0610 microns
0.00240 mil
After lamination
0.0813 microns
0.00320 mil
As received
1.57 microns
0.0620 mil
Thickness of laminate tested
Outgassing - Total Mass Loss 0.00 %

@Pressure <=1.33e-10 MPa,
Temperature 125 °C
0.00 %

@Pressure <=1.93e-8 psi,
Temperature 257 °F
Collected Volatiles; NASA SP-R-0022A
0.00 %

@Pressure <=1.33e-10 MPa,
Temperature 125 °C
0.00 %

@Pressure <=1.93e-8 psi,
Temperature 257 °F
Water Vapor Recovered; NASA SP-R-0022A
0.020 %

@Pressure <=1.33e-10 MPa,
Temperature 125 °C
0.020 %

@Pressure <=1.93e-8 psi,
Temperature 257 °F
NASA SP-R-0022A
Mechanical Properties Metric English Comments
Tensile Strength 48.3 MPa
7000 psi
Cross; ASTM D882
56.5 MPa
8200 psi
Machine; ASTM D882
Modulus of Elasticity 3.19 GPa
462 ksi
Cross; ASTM D638
3.25 GPa
471 ksi
Machine; ASTM D638
Flexural Modulus >= 2.59 GPa
>= 375 ksi
ASTM D790
Compressive Modulus 1.55 GPa
225 ksi
ASTM D695
Peel Strength 1.23 kN/m
7.00 pli
After Thermal Stress; IPC TM-650 2.4.8
Thermal Properties Metric English Comments
CTE, linear 10.0 µm/m-°C

@Temperature 0.000 - 100 °C
5.56 µin/in-°F

@Temperature 32.0 - 212 °F
x direction; IPC TM-650 2.4.24
12.0 µm/m-°C

@Temperature 0.000 - 100 °C
6.67 µin/in-°F

@Temperature 32.0 - 212 °F
y direction; IPC TM-650 2.4.24
CTE, linear, Transverse to Flow 35.0 µm/m-°C

@Temperature 0.000 - 100 °C
19.4 µin/in-°F

@Temperature 32.0 - 212 °F
z direction; IPC TM-650 2.4.24
Thermal Conductivity 0.500 W/m-K

@Temperature 100 °C
3.47 BTU-in/hr-ft²-°F

@Temperature 212 °F
ASTM E1225
Flammability, UL94 V-0
V-0
Vertical Burn
Electrical Properties Metric English Comments
Volume Resistivity 1.40e+14 ohm-cm
1.40e+14 ohm-cm
C96/35/90; IPC TM-650 2.5.17.1
Surface Resistance 1.30e+12 ohm
1.30e+12 ohm
C96/35/90; IPC TM-650 2.5.17.1
Dielectric Constant 2.94

@Frequency 1.00e+10 Hz
2.94

@Frequency 1.00e+10 Hz
C23/50; IPC TM-650 2.5.5.5
Dielectric Breakdown >= 45000 V
>= 45000 V
D48/50; ASTM D149
Dissipation Factor 0.0025

@Frequency 1.00e+10 Hz
0.0025

@Frequency 1.00e+10 Hz
C23/50; IPC TM-650 2.5.5.5
Arc Resistance >= 180 sec
>= 180 sec
D48/50; ASTM D495
Descriptive Properties Value Comments
Temperature Coefficient of Dielectric (ppm/°C) -12
IPC TM-650 2.5.5.5 (-10 - 140°C)
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