Mechanical Properties | Metric | English | Comments |
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Adhesive Bond Strength | 13.1 MPa | 1900 psi | Lap shear; 2024 T3 Al Abraded / MEK Wipe; Mixed 1:1; TM R050-37 |
Resinlab® EP1215 Clear Unfilled Epoxy Structural Adhesive Resinlab™ EP1215 Clear is a two part unfilled epoxy structural adhesive designed for bonding applications requiring high strength and good impact resistance. It cures completely at room temperature.. |
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Adhesive Bond Strength | 13.1 MPa | 1900 psi | lap shear (bond line thickness of 0.005"); ASTM D1002 |
ITW Devcon 5 minute® Epoxy, Light Amber Information provided by ITW Devcon |
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Adhesive Bond Strength | 13.1 MPa | 1900 psi | Lap shear, alum to alum, 2 hrs @ 65°C |
Tra-Con Tra-Bond 2112 Rigid Epoxy Staking Compound TRA-BOND 2112 is a thixotropic epoxy system recommended for critical electronic, aerospace and industrial bonding, laminating and reinforcing applications requiring an adhesive with high-fill, non-s.. |
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Adhesive Bond Strength | 13.1 MPa | 1900 psi | Lap shear, alum to alum, 2 hrs @ 65°C |
Tra-Con Tra-Bond 216D02 Thixotropic No-Sag Epoxy Adhesive TRA-BOND 216D02 is a thixotropic, two part epoxy adhesive formulated specifically for applications where a nonsagging adhesive is required. TRA-BOND 216D02 works in concert with TRA-CAST 3135 to per.. |
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Adhesive Bond Strength | 13.1 MPa | 1900 psi | Lap shear, alum to alum, 30 min @ 150°C |
Tra-Con Tra-Bond 221M02 Information provided by Tra-Con Inc. |
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Adhesive Bond Strength | 13.1 MPa | 1900 psi | Lap shear, alum to alum, 2 min @ 150°C |
Tra-Con Tra-Duct 2960 Snap Cure Electrically Conductive Silver-Filled Epoxy TRA-DUCT 2960 is a one or two-part, specially refined and processed silver filled adhesive for high speed manufacturing. Recommended for the microelectronic, automotive computer and telecommunicatio.. |
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Adhesive Bond Strength | 13.1 MPa | 1900 psi | |
Trelleborg Emerson & Cuming Eccobond® 104 Two-Component High Temperature Performance Epoxy Adhesive Emerson & Cuming 104 Eccobond® Two-Component High Temperature Performance Epoxy AdhesiveFilled, heat curing, high temperature resistant, epoxy adhesive. Excellent chemical resistance. Maintains hig.. |
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Adhesive Bond Strength | 13.1 MPa @Temperature 82.2 °C |
1900 psi @Temperature 180 °F |
Aluminum-Aluminum tensile shear |
Armstrong X-81/A Epoxy Adhesive Information provided by Ellsworth Adhesives. |
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Adhesive Bond Strength | 13.1 MPa | 1900 psi | Alum to Alum |
Atom Adhesives AA-BOND 2112 Epoxy Adhesive AA-BOND 2112 is a thixotropic epoxy system recommended for critical electronics, aerospace and industrial bonding, laminating and reinforcing applications requiring an adhesive with high-fill, non-s.. |