Polymer Property : Thickness = 20.0 microns Product List

Physical Properties

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Physical Properties	Metric	English	Comments
Thickness	20.0 microns	0.787 mil
SABIC FI1157 Bimodal High Density Polyethylene for Blown Film Product Description: FI1157 is a high molecular weight high density polyethylene copolymer grade specifically designed for blown film applications. Its high molecular weight, broad molecular weigh..
Thickness	20.0 microns	0.787 mil
NOVA Chemicals Novapol® TF-0438-E Hexene LMDPE Film Resin TF-0438-E complies with the U.S. FDA specifications for olefin polymers and may be used in the U.S. as an article or component of an article intended for use in contact with food, without temperatur..
Thickness	20.0 microns	0.787 mil
NOVA Chemicals Sclair® FG220-A Octene LLDPE Film Resin Features: Exceptional toughnessLow gel level Applications: Cast stretch wrapNettingCo-extrusion and laminationInformation provided by Nova Chemicals
Thickness	20.0 microns	0.787 mil
NOVA Chemicals Sclair® FP619-A Octene Copolymer LLDPE Film Resin FP619-A complies with the U.S. FDA specifications for olefin polymers and may thus be used in the United States as an article or component of an article intended for use in contact with food, withou..
Thickness	20.0 microns	0.787 mil	As tested for properties on this data sheet
NOVA Chemicals Surpass® FPs225-A Octene Copolymer sLLDPE Film Resin FPs225-A complies with the U.S. FDA regulations for olefin polymers and may thus be used in the United States as an article or component of an article intended for use in contact with food, without ..
Thickness	20.0 microns	0.787 mil
NOVA Chemicals Novapol® PF-0318-E Butene LLDPE Film Resin PF-0318-E complies with the U.S. FDA specifications for olefin polymers and may be used in the U.S. as an article or component of an article intended for use in contact with food. It is also biolog..
Thickness	20.0 microns	0.787 mil	Â± 3.0%; ASTM-252-78
Kinlead HSD11 Normal Grade Heat Sealable Film (thickness: 20 Âµm) HSD11 is a general, normal grade heat sealable film. It is transparent, and both sides are heat sealable. It has low static, excellent flatness and machinability, and good heat seal strength and dim..
Thickness	20.0 microns	0.787 mil	Â± 3.0%; ASTM-252-78
Kinlead HSD12 Normal Grade Heat Sealable Film (thickness: 20 Âµm) HSD12 is a printing, normal grade heat sealable film. It is transparent, and both sides are heat sealable. It has low static, good ink adhesion, and good heat seal strength. One side has corona trea..
Thickness	20.0 microns	0.787 mil	Â± 3.0%; ASTM-252-78
Kinlead HSD13 Normal Grade Heat Sealable Film (thickness: 20 Âµm) HSD13 is a metalizing, normal grade heat sealable film. It is transparent, and both sides are heat sealable. It has low static, excellent metal adhesion, and good heat seal strength. One side has co..
Thickness	20.0 microns	0.787 mil	Â± 3.0%; ASTM-252-78
Kinlead HSS11 Normal Grade Heat Sealable Film (thickness: 20 Âµm) HSS11 is a general, normal grade heat sealable film. It is transparent, and one side is heat sealable. It has low static, excellent flatness and machinability, and good heat seal strength and dimens..
Thickness	20.0 microns	0.787 mil	Â± 3.0%; ASTM-252-78
Kinlead HSS12 Normal Grade Heat Sealable Film (thickness: 20 Âµm) HSS12 is a printing, normal grade heat sealable film. It is transparent, and one side is heat sealable. It has low static, good ink adhesion, and good heat seal strength. One side has corona treatme..
Thickness	20.0 microns	0.787 mil	Â± 3.0%; ASTM-252-78
Kinlead LSD12 Low Temperature Grade Heat Sealable Film (thickness: 20 Âµm) LSD12 is a printing, low temperature grade heat sealable film. It is transparent, and both sides are heat sealable. It has low static, good ink adhesion, and good heat seal strength. One side has co..
Thickness	20.0 microns	0.787 mil	Â± 3.0%; ASTM-252-78
Kinlead LSS12 Low Temperature Grade Heat Sealable Film (thickness: 20 Âµm) LSS12 is a printing, low temperature grade heat sealable film. It is transparent, and one side is heat sealable. It has low static, good ink adhesion, and good heat seal strength. One side has coron..
Thickness	20.0 microns	0.787 mil	Â± 3.0%; ASTM-252-78
Kinlead LSS13 Low Temperature Grade Heat Sealable Film (thickness: 20 Âµm) LSS13 is a metalizing, low temperature grade heat sealable film. It is transparent, and one side is heat sealable. It has low static, excellent metal adhesion, and good heat seal strength. One side ..
Thickness	20.0 microns	0.787 mil	Â± 3.0%; ASTM-252-78
Kinlead ML11 General Grade BOPP Matt Film (thickness: 20 Âµm) ML11 is a general grade BOPP Matt film. It is translucent and non heat sealable. It has low static and a good matt surface. One side has corona treatment. It is specially designed for board laminati..
Thickness	20.0 microns	0.787 mil	Â± 3.0%; ASTM-252-78
Kinlead PL11 Lamination Grade BOPP Plain Film (thickness: 20 Âµm) PL11 is a general, lamination grade BOPP plain film. It is transparent and non heat sealable. It is excellent for extrusion lamination. One side has corona treatment. It is widely used in laminating..
Thickness	20.0 microns	0.787 mil	Â± 3.0%; ASTM-252-78
Kinlead PL21 Lamination Grade BOPP Plain Film (thickness: 20 Âµm) PL21 is a general, lamination grade BOPP plain film. It is transparent and non heat sealable. It is excellent for extrusion lamination. It has excellent dimensional stability, high tensile strength,..
Thickness	20.0 microns	0.787 mil	Â± 3.0%; ASTM-252-78
Kinlead PP11 Printing Grade BOPP Plain Film (thickness: 20 Âµm) PP11 is a general, printing grade BOPP plain film. It is transparent and non heat sealable. It has excellent ink adhesion. One side has corona treatment. It is widely used in printing applications.I..
Thickness	20.0 microns	0.787 mil	Â± 3.0%; ASTM-252-78
Kinlead PT11 Adhesive Tape Grade BOPP Plain Film (thickness: 20 Âµm) PT11 is a general, adhesive tape grade BOPP plain film. It is transparent and non heat sealable. It has excellent glue adhesion, good dimensional stability, and high tensile strength. One side has c..
Thickness	20.0 - 30.0 microns	0.787 - 1.18 mil
Gwent Electronic Materials C2030325D14 Curable Carbon Ink This product is based on a unique curing process that results in the low temperature formation of a thermosetting conductive coating that combines good adhesion with excellent chemical, solvent and ..
Thickness	20.0 - 30.0 microns	0.787 - 1.18 mil
Gwent Electronic Materials C2050425D1 Curable Carbon Ink This product is based on a unique curing process that results in the low temperature formation of a thermosetting conductive coating that combines good adhesion with excellent chemical, solvent and ..
Thickness	20.0 - 30.0 microns	0.787 - 1.18 mil	Using a 230 stainless steel mesh screen
Gwent Electronic Materials C2110817D5 Conductive Silver Polymer Paste This product is a thermoplastic screen printing ink, developed for use in membrane touch switch applications as well as counter electrode in electro-chemical sensors and conductive tracks. It may b..
Thickness	20.0 - 100 microns	0.787 - 3.94 mil	possible range, depending on extrusion conditions
Total EVA 1020 VN 3 Ethylene Vinyl Acetate Copolymer - Blown Film EVA 1020 VN 3 is made by a high pressure tubular process. Grade for flexible, very transparent films with high strength and very good sealability. Contains an antioxidant.Application examples: Thi..
Thickness	20.0 - 100 microns	0.787 - 3.94 mil	possible range, depending on extrusion conditions
Total EVA 1020 VN 5 Ethylene Vinyl Acetate Copolymer - Blown Film EVA 1020 VN 5 is made by a high pressure tubular process. Grade for very flexible films with very high transparency and good mechanical properties. Contains an antioxidant.Application examples: Ch..
Thickness	20.0 microns	0.787 mil
Total Lumicene® mPE M 4040 Metallocene Polyethylene, Cast Film Lumicene® mPE M 4040 is a Lumicene® metallocene based Polyethylene with hexene as comonomer.Lumicene® mPE M 4040 can be processed at high output rates with low extrusion pressure, low neck-in, ex..
Thickness	20.0 microns	0.787 mil
Total Lumicene® mPE M 2735 S01 Metallocene Polyethylene, Cast Film Lumicene® mPE M 2735 S01 is a Lumicene® metallocene based Polyethylene with hexene as comonomer.Lumicene® mPE M 2735 S01 can be processed at high output rates with low extrusion pressure, low nec..
Thickness	20.0 microns	0.787 mil	Double layer on 175µm ITO coated polyester
Gwent Electronic Materials D2090130P5 Pink Dielectric Ink This product is part of a range of Heat Curable Inks designed specifically for use in Electro Luminescent systems. These products are based on a unique curing process that results in the low tempera..
Thickness	20.0 microns	0.787 mil
Total Lumicene® mPE M 3427 Metallocene Polyethylene, Cast Film Lumicene® mPE M 3427 is a second generation metallocene based Polyethylene with hexene as comonomer.Lumicene® mPE M 3427 can be processed at high output rates with low extrusion pressure, low neck..