Polymer Property : Viscosity = 15000 cP Product List

Physical Properties

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Physical Properties	Metric	English	Comments
Viscosity	8000 - 15000 cP @Temperature 25.0 °C	8000 - 15000 cP @Temperature 77.0 °F
Northstar Polymers MPA-026 Isocyanate Prepolymer Information provided by Northstar Polymers.
Viscosity	100 - 15000 cP @Temperature 45.0 - 82.2 °C	100 - 15000 cP @Temperature 113 - 180 °F	Average value: 2520 cP Grade Count:8
Overview of materials for Thermoset Polyurethane, Liquid This property data is a summary of similar materials in the MatWeb database for the category "Thermoset Polyurethane, Liquid". Each property range of values reported is minimum and maximum values of..
Viscosity	11000 - 15000 cP @Temperature 25.0 °C	11000 - 15000 cP @Temperature 77.0 °F	Of resin
Resin Technology Group TIGA 101-EX Five-Minute Epoxy Adhesive 1 part resin to 1 part hardener.TIGA 101-EX is an exceptional epoxy formulation, recommended for lower temperature or wet industrial bonding applications where fast curing is required. This clear, t..
Viscosity	13000 - 15000 cP	13000 - 15000 cP
Huntsman MY 9634 Multifunctional Resin Weight per Epoxide (EEW, g/eq) 117 to 134. Color: BrownComments/Applications: Narrow viscosity MY 720. Used for high performance composites, adhesives, laminates and high energy radiation resistan..
Viscosity	10000 - 15000 cP @Shear Rate 230 1/s, Temperature 25.0 Â°C	10000 - 15000 cP @Shear Rate 230 1/s, Temperature 77.0 Â°F	Haake VT 550 PK1.1Â°
Gwent Electronic Materials C2020322D6 Platinum Polymeric Ink C2020322D6 is a screen printable Platinum ink designed for printing working electrodes in electrochemical sensor applications. The paste can be used to detect H2O2, is suitable for developing biose..
Viscosity	12000 - 15000 cP @Shear Rate 230 1/s, Temperature 25.0 Â°C	12000 - 15000 cP @Shear Rate 230 1/s, Temperature 77.0 Â°F	Haake VT 550 PK1.1Â°
Gwent Electronic Materials C2050106D7 Carbon Graphite Ink This Carbon Graphite Ink is designed to be used for screen printing working electrodes. This is an ink which has been optimized to give superior electrochemical performance. It gives excellent elec..
Viscosity	8000 - 15000 cP @Temperature 40.0 Â°C	8000 - 15000 cP @Temperature 104 Â°F
Taiwan PU Corporation PPG CPU-2095 Polyurethane Casting Elastomer A urethane elastomer that can be cured by reacting with a polyamine or a polyolhardener. The molding process is composed of pre-heating, degassing, maxing with a hardener, pouring into the mold, cu..
Viscosity	3000 - 15000 cP	3000 - 15000 cP
Solvay POLYCAREÂ® BOOST Surfactant Description: Water based emulsion of a high molecular weight linear polydimethylsiloxane containing a high delivery conditioning polymerC.T.F.A. /I.N.C.I. Name: WATER (AND) DIMETHICONE (AND) POLYQUA..
Viscosity	7500 - 15000 cP	7500 - 15000 cP	540MA3C52
Solvay MIRAPOLÂ® 550 P Surfactant Description: Mirapol 550 P can be used effectively in shampoos and conditioners at typical use levels of 0.5% (copolymer solids) to provide excellent lubricity, softeness light hair conditioning and..
Viscosity	7500 - 15000 cP	7500 - 15000 cP	#4 SP @ 10 rpm; RP-0596
Solvay MIRAPOLÂ® 550 Surfactant Description: Cationic polymer providing good wet/dry combability properties. Imparts smooth feel, anti-static, luster and detangling properties to the hair and silky feel to the skin. Stabilizes foa..
Viscosity	10000 - 15000 cP @Temperature 23.0 °C	10000 - 15000 cP @Temperature 73.4 °F
Master Bond EP21AR Acid Resistant Two Component Epoxy Master Bond EP21AR is a two component epoxy resin compound for durable, high performance, coating liner and adhesive/sealant with outstanding acid as well as excellent overall chemical resistance. E..
Viscosity	11000 - 15000 cP	11000 - 15000 cP	Part B
Master Bond EP21LVMed Two Component, Low Viscosity USP Class VI Epoxy Master Bond EP21LVMed is a two component, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulating and casting. It is formulated to cure readily at room tempera..
Viscosity	9000 - 15000 cP	9000 - 15000 cP	Part A
Master Bond EP30HV Optically Clear, High Strength Two Part Epoxy Description: Master Bond EP30HV is a lower viscosity, two component epoxy system for high performance bonding, sealing, coating and potting. It is formulated to cure at room temperature or more rapi..
Viscosity	12000 - 15000 cP	12000 - 15000 cP
Master Bond Mastersil 150 Two Part, Condensation Cured, Flexible Silicone Master Sil 150 is a 2 part condensation cured liquid silicone which, after the addition of curing agent 150, cures at room temperature to a tough, resilient silicone rubber potting and encapsulation..
Viscosity	11000 - 15000 cP	11000 - 15000 cP	Part B
Master Bond EP21CLV Two Component Epoxy System Product Description: Master Bond EP21CLV is a two component, lower viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulation and casting. It features easy handling a..
Viscosity	12000 - 15000 cP	12000 - 15000 cP	Dynamic
Dow Corning XIAMETER® PMCPOHX-4040 Polymer 14000CS Is chemically equivalent to DOW CORNING® 3-0084 POLYMER. Polydimethylsiloxane polymer with terminated, curable silanol functionality.Information provided by Dow Corning
Viscosity	9000 - 15000 cP @Temperature 23.0 °C	9000 - 15000 cP @Temperature 73.4 °F	20 rpm
Epoxy Technology EPO-TEK® 353ND-T Black High Temperature Thixotropic Epoxy Product Description: EPO-TEK® 353ND-T Black is a two component, high temperature, thixotropic epoxy for fiber optic, PCB and various medical applications. Advantages & Application Notes: This produ..
Viscosity	9000 - 15000 cP @Temperature 23.0 °C	9000 - 15000 cP @Temperature 73.4 °F	20 rpm
Epoxy Technology EPO-TEK® 353ND-T High Temperature Thixotropic Epoxy Product Description: EPO TEK® 353ND-T is a two component, highly thixotropic epoxy with non-flowing properties and high temperature resistance. Advantages & Application Notes: Suitable for fiber op..
Viscosity	10000 - 15000 cP @Temperature 23.0 °C	10000 - 15000 cP @Temperature 73.4 °F	50 rpm
Epoxy Technology EPO-TEK® B9021-1 Epoxy Paste Material Description: A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate atta..
Viscosity	9000 - 15000 cP @Temperature 23.0 °C	9000 - 15000 cP @Temperature 73.4 °F	20 rpm
Epoxy Technology EPO-TEK® H54 High Temperature Epoxy Product Description: EPO-TEK® H54 is a two component, high Tg, electrically and thermally insulating epoxy adhesive for general bonding and high temperature packaging in medical, hybrid, and optica..
Viscosity	11000 - 15000 cP	11000 - 15000 cP
3M Scotch-Weld™ 183 B/A Translucent Epoxy Adhesive 3M™ Scotch-Weld™ Epoxy Adhesive 1838 B/A is a controlled flowable product. This epoxy adhesives are two-part, room temperature curing structural adhesives with high shear strengths and excellent e..
Viscosity	12000 - 15000 cP	12000 - 15000 cP
Beijing Ranger Chem SM-828CA Liquid Epoxy Resin Information provided by Beijing Ranger Chemical Co.
Viscosity	13000 - 15000 cP	13000 - 15000 cP
Beijing Ranger Chem SM828R Liquid Epoxy Resin Information provided by Beijing Ranger Chemical Co.
Viscosity	8000 - 15000 cP	8000 - 15000 cP
Beijing Ranger Chem SM-601RX75 Solvent Based Epoxy Resin Information provided by Beijing Ranger Chemical Co.
Viscosity	10000 - 15000 cP	10000 - 15000 cP
Lucite International Colacryl ® TS1171 Acrylic Solution Resin Butyl methacrylate-Methyl methacrylate copolymerThis product is a fairly soft and flexible copolymer with reasonable abrasion resistance. It has good UV resistance and is therefore suitable for outd..