Physical Properties | Metric | English | Comments |
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Viscosity | 11000 cP @Shear Rate 11200 1/s, Temperature 200 °C |
11000 cP @Shear Rate 11200 1/s, Temperature 392 °F |
ASTM D3835 |
PolyOne Dynaflex™ G2701-1000-02 Thermoplastic Elastomer (TPE) Dynaflex™ G2701-1000-02 is an easy processing TPE designed for injection molding and extrusion applications that require FDA compliance. - Adhesion to Polypropylene - Excellent Colorability - Good .. |
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Viscosity | 11000 - 14000 cP | 11000 - 14000 cP | |
Huntsman Araldite GY 2600 Bisphenol A Epoxy Liquid Resin Weight per Epoxide (EEW, g/eq) 184 to 188. Max color is 1.Comments/Applications: High purity GY 6010 with narrow range epoxy value. Low hydrolyzable chlorine. For use in critical applications suc.. |
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Viscosity | 11000 - 14000 cP | 11000 - 14000 cP | |
Huntsman Araldite GY 6010 Bisphenol A Epoxy Liquid Resin Weight per Epoxide (EEW, g/eq) 182 to 192. Max color is 1.Comments/Applications: Unmodified basic liquid epoxy resin based on bis A and epichlorohydrin. General purpose, highly versatile resin for.. |
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Viscosity | 11000 - 13000 cP | 11000 - 13000 cP | |
Huntsman MY 9512 Multifunctional Resin Weight per Epoxide (EEW, g/eq) 117 to 134. Color: BrownComments/Applications: Narrow viscosity MY 720. Used for high performance composites, adhesives, laminates and high energy radiation resistant.. |
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Viscosity | 11000 - 19000 cP @Shear Rate 100 1/s, Temperature 25.0 °C |
11000 - 19000 cP @Shear Rate 100 1/s, Temperature 77.0 °F |
Haake VT550 cone and plate viscometer (PK1.1°) |
Gwent Electronic Materials C2000107P3 Silver Ink Silver Ink C2000107P3 is designed as a termination for single layer PZT ceramics. After firing the film has good adhesion and solderability.The ink is in a ready to use form at a viscosity suitable.. |
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Viscosity | 11000 cP @Shear Rate 230 1/s, Temperature 25.0 °C |
11000 cP @Shear Rate 230 1/s, Temperature 77.0 °F |
Haake Viscosity |
Gwent Electronic Materials C2050425D1 Curable Carbon Ink This product is based on a unique curing process that results in the low temperature formation of a thermosetting conductive coating that combines good adhesion with excellent chemical, solvent and .. |
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Viscosity | 11000 - 16000 cP @Shear Rate 230 1/s, Temperature 25.0 °C |
11000 - 16000 cP @Shear Rate 230 1/s, Temperature 77.0 °F |
Haake VT 550 PK1.1° |
Gwent Electronic Materials C2061103D7 Lead free Silver Zinc Basecoat Paste This product is a lead-free version of C70709D22. The ink is designed as a screen printing ink for coating Barium Titanate PTC ceramics as the base layer of a two part system. The dried film should.. |
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Viscosity | 11000 cP @Shear Rate 230 1/s, Temperature 25.0 °C |
11000 cP @Shear Rate 230 1/s, Temperature 77.0 °F |
Haake VT 550 PK1.1° |
Gwent Electronic Materials G2020520D1 Gold Metallo-Organic Ink This is a screen printing ink designed to act as a working electrode when fired onto alumina substrates. This unique MO formulation gives a fired thickness in the order of 0.2 to 0.3 microns. This.. |
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Viscosity | 11000 cP @Temperature 25.0 °C |
11000 cP @Temperature 77.0 °F |
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Momentive Performance Materials RTV11 White General Purpose Potting/Encapsulating Compound Two-part condensation cure. Two-part condensation cure silicones RTVs are designed to cute at room temperature, and can be applied at temperature up to one inch (2.5 cm). These are very tough mate.. |
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Viscosity | 11000 cP @Temperature 25.0 °C |
11000 cP @Temperature 77.0 °F |
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Momentive Performance Materials RTV8112 White General Purpose Potting/Encapsulating Compound Two-part condensation cure. Two-part condensation cure silicones RTVs are designed to cute at room temperature, and can be applied at temperature up to one inch (2.5 cm). These are very tough mate.. |
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Viscosity | 11000 - 18000 cP @Shear Rate 230 1/s, Temperature 25.0 °C |
11000 - 18000 cP @Shear Rate 230 1/s, Temperature 77.0 °F |
Haake VT 550 PK1.1° |
Gwent Electronic Materials C2100217D1 Aluminium for PTC paste Aluminium Ink designed to give good ohmic contact on to barium titanate PTC components. This product is particularly good where large volumes of PTC components are being processed in belt furnaces .. |
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Viscosity | 11000 cP @Shear Rate 10994 1/s, Temperature 210 °C |
11000 cP @Shear Rate 10994 1/s, Temperature 410 °F |
ASTM D3835 |
STAR Thermoplastic Alloys & Rubbers StarMediflex P 7070-1000 TPE Product Description: StarMediflex P 7070-1000 is an easy processing TPE designed for injection molding. This particular class of TPE material for medical products and tubing applications. Features:S.. |
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Viscosity | 11000 - 15000 cP | 11000 - 15000 cP | Part B |
Master Bond EP21LV-LO Two Component, Lower Viscosity, Room Temperature Curing Epoxy System Product Description: Master Bond EP21LV-LO is a two component, lower viscosity, room temperature curing epoxy system for high performance bonding, sealing, coating and encapsulation. This user frien.. |
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Viscosity | 11000 - 15000 cP | 11000 - 15000 cP | Part B |
Master Bond EP21LVMed Two Component, Low Viscosity USP Class VI Epoxy Master Bond EP21LVMed is a two component, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulating and casting. It is formulated to cure readily at room tempera.. |
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Viscosity | 11000 - 15000 cP | 11000 - 15000 cP | Part B |
Master Bond EP21CLV Two Component Epoxy System Product Description: Master Bond EP21CLV is a two component, lower viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulation and casting. It features easy handling a.. |
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Viscosity | 11000 cP | 11000 cP | |
Loctite® PRISM® 4212 Instant Adhesive Gel Cyanoacrylate Bonding AdhesivesLoctite® technology has made the productivity promises of cyanoacrylate adhesives a reality with the industry's widest selection of high-performance, application-.. |
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Viscosity | 11000 cP @Temperature 25.0 °C |
11000 cP @Temperature 77.0 °F |
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Cytec (Conap) FR-1610 / EA-039 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an.. |
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Viscosity | 11000 - 17000 cP @Temperature 23.0 °C |
11000 - 17000 cP @Temperature 73.4 °F |
20 rpm |
Epoxy Technology EPO-TEK® 353ND-T4 Thixotropic Epoxy Product Description: EPO-TEK® 353ND-T4 is a two component, highly thixotropic epoxy with non-flowing properties and high temperature resistance. This is a higher viscosity version of EPO-TEK® 353.. |
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Viscosity | 11000 - 14000 cP @Temperature 23.0 °C |
11000 - 14000 cP @Temperature 73.4 °F |
20 rpm |
Epoxy Technology EPO-TEK® E2001-HV Electrically Conductive, Silver-Filled Epoxy Product Description: EPO-TEK® E2001-HV Is a snap cure, two component, silver-filled die attach adhesive for semiconductor plastic IC packaging.Advantages & Application Notes:Snap cure adhesive or f.. |
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Viscosity | 11000 - 14000 cP @Temperature 23.0 °C |
11000 - 14000 cP @Temperature 73.4 °F |
20 rpm |
Epoxy Technology EPO-TEK® E3001-HV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & .. |
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Viscosity | 11000 - 15000 cP | 11000 - 15000 cP | |
3M Scotch-Weld™ 183 B/A Translucent Epoxy Adhesive 3M™ Scotch-Weld™ Epoxy Adhesive 1838 B/A is a controlled flowable product. This epoxy adhesives are two-part, room temperature curing structural adhesives with high shear strengths and excellent e.. |
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Viscosity | 11000 cP | 11000 cP | mixed |
Aremco Ceramacast™ 575-N High Temperature Potting & Casting Material Alumina Fine grain castable for potting and producing small tools. |
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Viscosity | 11000 - 14000 cP | 11000 - 14000 cP | 50-3 |
Abatron AboCast 50-3/AboCure 50-1 Epoxy Data provided by the manufacturer, Abatron, Inc. Honey viscosity, light amber color. Best combination of high strength and versatility for Abatron "VR" Epoxies. Shelf life is 12+ months.Processin.. |
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Viscosity | 11000 - 13000 cP | 11000 - 13000 cP | Uncured, after Mixing |
Atom Adhesives AA-BOND 2156 Epoxy Adhesive AA-BOND 2156 is a thixotropic (smooth paste) thermally conductive epoxy system. It is used for staking heat sinks, transistors, diodes, resistor, integrated circuits and other heat-sensitive compone.. |
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Viscosity | 11000 - 14000 cP | 11000 - 14000 cP | Dynamic |
Dow Corning 3-0135 Cosmetic Fluid Polydimethylsiloxane polymer with terminated, curable silanol functionality.Information provided by Dow Corning |
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Viscosity | 11000 cP | 11000 cP | Mixed; TM R050-12 |
Resinlab® EP1026R Rubber Modified Epoxy Adhesive Resinlab™ EP1026R is a two part unfilled rubber modified epoxy adhesive designed for high speed bonding of metals, ceramics, and most plastics. It cures to a tough semi-rigid material, and is free .. |
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Viscosity | 11000 cP @Shear Rate 10994 1/s, Temperature 210 °C |
11000 cP @Shear Rate 10994 1/s, Temperature 410 °F |
ASTM D3835 |
STAR Thermoplastic Alloys & Rubbers StarFlex® P 7175-1000 TPE Product Description: StarFlex P 7175-1000 is an easy processing TPE designed for injection molding Features:Soft TouchRubbery FeelExcellent ColorabilityGood WeatherabilityFDA and medical grades avai.. |
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Viscosity | 11000 - 14000 cP | 11000 - 14000 cP | 50-3 |
Abatron AboCast 50-3/AboCure 50-17 Epoxy Data provided by the manufacturer, Abatron, Inc. Very low-viscosity; Dark Amber color. Shelf life is 12+ months. |