Physical Properties | Metric | English | Comments |
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Specific Gravity | 2.67 g/cc | 2.67 g/cc | |
Oceanchem Group Zinc Borate Information Provided by Oceanchem Group |
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Specific Gravity | 2.67 g/cc | 2.67 g/cc | |
Unifrax Fiberfrax® 6001-C-5 Kaolin Bulk Fiber Fiberfrax Bulk Fibers are manufactured to be used as feedstock in manufacturing processes or other applications where product consistency is critical. Manufactured on large, computer-controlled fur.. |
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Specific Gravity | 2.67 g/cc | 2.67 g/cc | |
Unifrax Fiberfrax® 6001-F-5 Kaolin Bulk Fiber Fiberfrax Bulk Fibers are manufactured to be used as feedstock in manufacturing processes or other applications where product consistency is critical. Manufactured on large, computer-controlled fur.. |
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Specific Gravity | 2.67 g/cc | 2.67 g/cc | |
Unifrax Fiberfrax® 6001-M-5 Kaolin Bulk Fiber Fiberfrax Bulk Fibers are manufactured to be used as feedstock in manufacturing processes or other applications where product consistency is critical. Manufactured on large, computer-controlled fur.. |
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Specific Gravity | 2.67 g/cc | 2.67 g/cc | |
Unifrax Fiberfrax® HSA-K Kaolin High-Index Fiber In addition to Fiberfrax Bulk Fibers, Unifrax has the ability to produce many different specialty fibers that provide a variety of desirable performance properties for certain applications. These f.. |
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Specific Gravity | 2.67 g/cc | 2.67 g/cc | |
Unifrax Insulfrax® S Blanket Insulation Insulfrax S Blanket is a flexible, strong, lightweight, needled blanket produced from Insulfrax Fiber. Mechanical needling of the spun Insulfrax fibers eliminates the need for binders in the produc.. |
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Specific Gravity | 2.67 g/cc | 2.67 g/cc | |
Unifrax Fiberfrax® Bulk 6000 Kaolin Bulk Fiber Fiberfrax Bulk Fibers are manufactured to be used as feedstock in manufacturing processes or other applications where product consistency is critical. Manufactured on large, computer-controlled fur.. |
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Specific Gravity | 2.67 g/cc | 2.67 g/cc | Part A |
Epoxy Technology EPO-TEK® E2001-HV Electrically Conductive, Silver-Filled Epoxy Product Description: EPO-TEK® E2001-HV Is a snap cure, two component, silver-filled die attach adhesive for semiconductor plastic IC packaging.Advantages & Application Notes:Snap cure adhesive or f.. |