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- Polymer Property : Particle Size = 50 µm
Polymer Property : Particle Size = 50 µm Product List
Physical PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Particle Size | 50 - 80 µm | 50 - 80 µm | Median Grain Diameter |
| Nabaltec GRANALOX® NM 9922 I Ceramic Bodies Nabaltec`s GRANALOX® Ceramic bodies are produced under rigid quality control of green and sintered density, shrinkage, porosity, loss on ignition and granulate size. The properties of the corundum .. |
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| Particle Size | 50 µm | 50 µm | Average Diameter |
| Potters Industries Conduct-O-Fil® AGSF-20 Silver-coated Hollow Ceramic Spheres Applications: Conductive paints and coatings; Aerospace and other mass-critical applications. Advantages include low density, easily mixed into paint systems, large particle sizeInformation provide.. |
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| Particle Size | 50 - 200 µm | 50 - 200 µm | spherical sizes available |
| PPT FP160 Fully Sintered Ferrite Powder Fully sintered NiZn ferrite, MnZn ferrite, and MgZn ferrite powders are available. Spherical or irregular particle shapes in custom particle sizes are available, ranging from sub-micron to a few hu.. |
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| Particle Size | 50 - 200 µm | 50 - 200 µm | spherical sizes available |
| PPT FP215 Fully Sintered Ferrite Powder Fully sintered NiZn ferrite, MnZn ferrite, and MgZn ferrite powders are available. Spherical or irregular particle shapes in custom particle sizes are available, ranging from sub-micron to a few hu.. |
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| Particle Size | 50 µm | 50 µm | Average; ISO 13320-1 |
| Victrex® PEEK 450PF Fine Powder Grade Product Description: High performance thermoplastic material, unreinforced PolyEtherEtherKetone (PEEK), semi crystalline, fine powder for compression molding, standard flow, FDA food contact complia.. |
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| Particle Size | 50 µm | 50 µm | D50 |
| Malvern Minerals Wollastokup® FT Silane Treated Wollastonite Wollastokup® is a custom, silane treated calcium metasilicate (wollastonite) which is used as a functional filler in coatings, plastics, rubber and others due in part to its acicular or “too.. |
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| Particle Size | 50 - 60 µm | 50 - 60 µm | 90% |
| H.C. Starck Amperit® 105.074 Agglomerated Sintered Molybdenum (Mo) |
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| Particle Size | 50 - 60 µm | 50 - 60 µm | 90% |
| H.C. Starck Amperit® 538.074 Agglomerated, Sintered Tungsten Carbide-Tungsten Boride-Cobalt (WC-WB-Co ) 60-30-10 |
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| Particle Size | 50 - 60 µm | 50 - 60 µm | 90% |
| H.C. Starck Amperit® 559.074 Agglomerated, Sintered Tungsten Carbide-Cobalt-Chromium 86-6-8 (WC-Co-Cr) |
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| Particle Size | 50 - 62 µm | 50 - 62 µm | 90% |
| H.C. Starck Amperit® 832.054 Zirconium Oxide-Yttrium Oxide 93-7 (ZrO2-Y2O3) |
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| Particle Size | >= 50 µm | >= 50 µm | |
| Solvay Chemicals Rigmah® BO350 Information provided by Solvay |
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| Particle Size | 50 µm | 50 µm | TEC QSD |
| Trelleborg AEM Eccospheres® SI-310 Sodium Borosilicate Glass Microspheres Eccospheres® glass microspheres are hollow thin-walled glass microspheres composed of sodium borosilicate glass. To the naked eye they resemble a fine, white, free-flowing powder. However, magnific.. |
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| Particle Size | 50 µm | 50 µm | TEC QSD |
| Trelleborg AEM Eccospheres® SID-311Z Sodium Borosilicate Glass Microspheres Eccospheres® glass microspheres are hollow thin-walled glass microspheres composed of sodium borosilicate glass. To the naked eye they resemble a fine, white, free-flowing powder. However, magnific.. |
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| Particle Size | 50 µm | 50 µm | TEC QSD |
| Trelleborg AEM Eccospheres® W-25 Sodium Borosilicate Glass Microspheres Eccospheres® glass microspheres are hollow thin-walled glass microspheres composed of sodium borosilicate glass. To the naked eye they resemble a fine, white, free-flowing powder. However, magnific.. |
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| Particle Size | <= 50 µm | <= 50 µm | |
| Epoxy Technology EPO-TEK® 430 Epoxy Product Description: A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for interconnecting, grounding .. |
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| Particle Size | <= 50 µm | <= 50 µm | |
| Epoxy Technology EPO-TEK® 431 Copper Filled Epoxy A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for interconnecting, grounding and EMI RF shielding... |
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| Particle Size | <= 50 µm | <= 50 µm | |
| Epoxy Technology EPO-TEK® H81A Epoxy Material Description: A two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging.Information Provided by Epoxy Technolo.. |
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| Particle Size | 50 - 80 µm | 50 - 80 µm | D(0.5) |
| Akzo Nobel Expancel® 551 WE 80 d36 Wet expanded microspheres Expancel microspheres are thermoplastic hollow spheres. The microspheres are white spherically formed particles with a thermoplastic shell encapsulating a gas. When the microspheres are heated the.. |
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| Particle Size | 50 µm | 50 µm | D50 |
| ALM PA 601-CF Filled Nylon 12 Prototyping Polymer Carbon fiber filled nylon 12 easy to process, strong light weight filled material.Low density, good dimensional stability while maintaining excellent mechanical properties.Fibers have been optimized.. |
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| Particle Size | 50 µm | 50 µm | D50 |
| ALM PA-615-GS Filled Nylon 12 Prototyping Polymer 50% glass sphere filled material for improved dimensional stability, increased stiffness, and higher temperature applications when compared to unfilled PA.Drop-in replacement for other commercially .. |
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