Polymer Property : Density = 0.126 lb/in³ Product List

Physical Properties

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Physical Properties	Metric	English	Comments
Density	>= 3.50 g/cc	>= 0.126 lb/in³	Before Sintering
NBE nanoTach® Nano-Silver Paste, Lead-Free Solder Alternative NanoTach® is a thick paste of nano-sized silver powder in an organic binder that can be used as an alternative to solder or epoxy in semiconductor devices in the state-of-the-art individual package..
Density	3.48 g/cc	0.126 lb/inÂ³	calculated from bulk density after subtracting pore volume
MarkeTech Repton 914 Magnesia MgO REPTON setter tiles, kiln furniture, and special fixtures are lightweight, ridge, and high strength ceramics that resist distortion and spalling, even when thermal cycled many times. They are availa..
Density	3.50 g/cc	0.126 lb/inÂ³
MMCC Al/Al2O3 Continuous Fiber Aluminum Matrix Composite Cast, reinforced aluminum matrix composite. May be fabricated by vacuum infiltration of the ceramic preform.Data provided by the manufacturer, Metal Matrix Cast Composites (MMCC).
Density	3.50 g/cc	0.126 lb/inÂ³
Schott S8806A Contrast Enhancement Filter Contrast Enhancement FilterInformation Provided by SCHOTT North America, Inc.
Density	3.50 g/cc	0.126 lb/inÂ³	ASTM D792
Techmer ES HiFillÂ® ABS 0350 Availability: North AmericaFeatures: High DensityForms: PelletsProcessing Method: Extrusion MoldingInformation provided by TP Composites, Inc.
Density	3.50 g/cc	0.126 lb/inÂ³	ASTM D792
Techmer ES HiFillÂ® ABS HI 350 High Impact Availability: North AmericaForms: PelletsFiller/Reinforcement: Unspecified Filler/ReinforFeatures: High Density and High Impact ResistanceProcessing Method: Injection MoldingInformation provided by ..
Density	3.48 g/cc	0.126 lb/inÂ³	ASTM D792
Techmer ES HiFillÂ® PA6 0348 Availability: North AmericaForms: PelletsFeatures: High Specific GravityInformation provided by TP Composites, Inc.
Density	3.50 g/cc	0.126 lb/in³
Trelleborg Emerson & Cuming Eccobond® 56C Two-Component Silver Filled Electrically Conductive Epoxy Adhesive Emerson & Cuming 56C Eccobond® Two-Component Silver Filled Electrically Conductive Epoxy AdhesiveSilver filled, high electrical conductivity, epoxy adhesive. Excellent thermal conductivity. Require..
Density	3.50 g/cc	0.126 lb/in³
Trelleborg Emerson & Cuming Eccobond® 57C Two-Component Silver Filled Electrically Conductive Epoxy Adhesive Emerson & Cuming 57C Eccobond® Two-Component Silver Filled Electrically Conductive Epoxy AdhesiveSilver filled, electrically conductive, room temperature curing, epoxy adhesive. Good thermal conduc..
Density	3.50 g/cc	0.126 lb/in³
Epoxyset Epoxiohm EO-98HT Electrically Conductive Epoxy Adhesive EO-98HT is a one component, electrically and thermally conductive, snap cure, die attach epoxy. It was designed for IC plastic packaging of semiconductors, hybrid micro-electronics, and photonic dev..
Density	3.50 g/cc	0.126 lb/in³
Ceradyne Ceralloy® 6703 MgO-SiC Applications: absorbersbuttonsInformation provided by Ceradyne Company
Density	3.50 g/cc	0.126 lb/in³
Anderman Ceramics EA99P Sintered Alumina, 99%, Porous Densely sintered alumina is characterized by: high strength and hardness, temperature stability, electrical insulation, and high wear resistance and corrosion resistance even at high temperatures. ..
Density	3.48 g/cc	0.126 lb/in³
Ceradyne Ceralloy® 6705 MgO-SiC Applications: absorbersbuttonsInformation provided by Ceradyne Company