Polymer Property : Density = 3.20 g/cc Product List

Physical Properties

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Physical Properties	Metric	English	Comments
Density	3.20 g/cc	0.116 lb/in³
NanoScale NanoActive® Magnesium Oxide NanoActive MgO is produced using proprietary processes to obtain high specific surface area, small crystallite size material possessing high chemical reactivity, particularly at elevated temperature..
Density	3.20 - 3.65 g/cc	0.116 - 0.132 lb/inÂ³
MarkeTech MC-LD and MC-MD Ultra High Temperature Machinable Ceramics For very high temperatures or where thermal conductivity or thermal shock is important, these machinable alkaline/alkaline earth zirconium phosphate ceramics (NaZr2P3O12 or BaZr4P6O24) are recommend..
Density	3.20 g/cc	0.116 lb/inÂ³
Schott N-BASF64 Glass Information Provided by SCHOTT North America, Inc.
Density	3.20 g/cc	0.116 lb/inÂ³
Schott N-KZFS11 Glass Information Provided by SCHOTT North America, Inc.
Density	3.20 g/cc	0.116 lb/inÂ³	ASTM D792
Techmer ES HiFillÂ® PP 0320 S1 Polypropylene Availability: North AmericaForms: PelletsFiller/Reinforcement: Unspecified Filler/ReinforFeatures: Good Corrosion ResistanceInformation provided by TP Composites, Inc.
Density	3.20 g/cc	0.116 lb/inÂ³
Saint-Gobain MicaverÂ® Glass-Mica Electrical Insulator, Compression Moldings Glass-mica compound that occupies a place between plastics and ceramics in terms of usage temperature. It can be molded and machined like plastics and has the mechanical properties (strength, hardn..
Density	3.20 g/cc	0.116 lb/inÂ³
Sapco Silicon Nitride, Si3N4 Information provided by Sapco.
Density	3.20 g/cc	0.116 lb/inÂ³
Schott N-KZFS8 Glass Information Provided by SCHOTT North America, Inc.
Density	3.20 g/cc	0.116 lb/in³
American Elements Silicon Nitride Nanoparticles General DescriptionSilicon Nitride (SiN) Nanoparticles, nanodots or nanopowder are spherical high surface area particles. Nanoscale Silicon Nitride Particles are typically 10 - 100 nanometers (nm) w..
Density	3.20 g/cc	0.116 lb/in³
Epoxyset Epoxiohm EO-30M-1 Electrically Conductive Epoxy Adhesive EO-30M-1 is a two part, semi-rigid, silver filled, epoxy adhesive. EO-30M-1 exhibits superior adhesion to a wide variety of substrates including most metals, ceramics, glass and plastics.Information..
Density	3.20 g/cc	0.116 lb/in³
Epoxyset Epoxiohm EO-38M-3 Electrically Conductive Epoxy Adhesive EO-38M-3 is a two components, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is used for thermal management appl..
Density	3.20 g/cc	0.116 lb/in³
Epoxyset Epoxiohm EO-97M Electrically Conductive Epoxy Adhesive EPOXIOHM-97M is one part, pure silver filled, high electrical conductivity, epoxy adhesive. It is designed for microelectronics chip bonding application.Information provided by Epoxyset Inc.
Density	3.20 g/cc	0.116 lb/in³	ISO 1183
Azoty Tarnow™ TARFLEN SM-B40 PTFE Reinforced with 40% bronze for standard compression molding.Information provided by Zakłady Azotowe w Tarnowie-Moscicach S.A.
Density	3.20 g/cc	0.116 lb/in³
Arlon TC600 Glass, PTFE and Micro-Dispersed Ceramic High Thermal Conductivity, Excellent Dielectric Constant Control and Phase Stability with TemperatureInformation provided by Arlon Materials for Electronics (MED).
Density	3.20 g/cc	0.116 lb/in³
Ceradyne CeraTrex™ 146-3E Silicon Carbide Features:high puritycorrosion resistancewear resistancetailored electrical properties Applications:semiconductor componentssputtering targetsballistic armorwear componentsInformation provided by Cer..
Density	3.20 g/cc	0.116 lb/in³
Ceradyne CeraTrex™ SC-P2 Silicon Carbide Features:purity>99.9995%corrosion resistancewear resistancenear net shape fabrication to 400 mm OD Applications:semiconductor componentswear componentsInformation provided by Ceradyne Company
Density	3.20 g/cc	0.116 lb/in³
Ceradyne CeraTrex™ SC-P3 Silicon Carbide Features:purity>99.9995%corrosion resistancewear resistancenear net shape fabrication to 400 mm OD Applications:semiconductor componentswear componentsInformation provided by Ceradyne Company
Density	3.20 g/cc	0.116 lb/in³	A Component; ASTM D1475
Aptek 2210A/B Electrically conductive urethane adhesive Electrically conductive urethane adhesive, silver-filled, flexible low modulus, low outgassingAPTEK 2210-A/B is a two component, silver-filled, urethane adhesive designed for application where flexi..
Density	3.20 g/cc	0.116 lb/in³	ASTM D792 Method A
Arlon AD1000 PTFE/Woven Fiberglass/Ceramic Filled Laminate for Microwave Printed Circuit Boards Only Woven Glass Reinforced PTFE/Ceramic with Dk of 10.2 or greaterHigh Copper Peel Strength allows for thinner etched line widthsLowest insertion loss availableLarger Panel sizes availableLow moist..
Density	3.20 g/cc	0.116 lb/in³
Parker Chomerics CHO-BOND 1024 Conductive Silicone Splicing Compound Conductive splicing compounds are intended for making "custom" EMI/RFI gaskets from standard CHO-SEAL® and CHO-SIL® strips. Compounds consist of Chomerics silver-bearing powders dispersed in silic..
Density	3.20 g/cc	0.116 lb/in³
Ceradyne Ceralloy® 147-31N Sintered Reaction Bonded Silicon Nitride (Si3N4) Ceralloy® 147 Reaction Bonded Silicon Nitride (RBSN) is a high purity grade of silicon nitride. RBSN has excellent thermal shock resistance and outstanding compatibility with non-ferrous molten met..
Density	3.20 g/cc	0.116 lb/in³
Ceradyne CeraTrex™ 146-S5 Silicon Carbide Features:corrosion resistancewear resistancehardnessnet shape fabricationApplications:wear componentsInformation provided by Ceradyne Company
Density	3.20 g/cc	0.116 lb/in³
Mo-Sci Corporation YB-40-I Yellow B Filter Glass Applications: Lead-free NVIS Yellow class B filter glass for incandescent light sources.Information provided by Mo-Sci Corporation.
Density	3.20 g/cc	0.116 lb/in³
Mo-Sci Corporation YB-40-N Yellow B Filter Glass Applications: Lead-free NVIS Yellow class B filter glass for white LED sources.Information provided by Mo-Sci Corporation.