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Zyvex Performance Materials Aroply™ 250 Nano-Engineered Composite Film Adhesive

Category Polymer , Thermoset , Carbon Fiber/Thermoset Composite
Manufacturer Zyvex Performance Materials (ZPM)
Trade Name Aroply™
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Zyvex Performance Materials Aroply™ 250 Nano-Engineered Composite Film Adhesive.pdf
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Material Notes:
Aroply™ 250 Film Adhesive is a versatile, heat curing carbon-nanotube modified epoxy structural film adhesive available in a variety of film weights on a supported knitted nylon carrier. Cured adhesive characteristics are designated by exceptionally high shear and peel strengths on a variety of substrates. This film adhesive is designed for both solid panel and honeycomb constructions. The film adhesive was designed to meet the specifications of MMM-A132B Type I Class 2. Aroply™ contains an optimum level of carbon nanotubes for additional toughness and enhanced mechanical properties. The carbon nanotubes use molecular dispersion technology to ensure enhancements are evenly distributed throughout the adhesive. Features: Wide range of cure properties: 180°F-350°F (82°C-177°C) at vacuum or clamp pressure to >100 psiTacky for adherence to desired locationLong Open Time: 30+ days in standard shop conditionsAdaptable to many processes
Mechanical Properties Metric English Comments
Flexural Strength 46.2 MPa
6700 psi
5 lb Core, 6 hrs @ 220°F, Vacuum Bag
49.0 MPa
7100 psi
8 lb Core, 6 hrs @ 220°F, Vacuum Bag
Flexural Modulus 6.29 GPa
913 ksi
5 lb Core, 6 hrs @ 220°F, Vacuum Bag
6.76 GPa
980 ksi
8 lb Core, 6 hrs @ 220°F, Vacuum Bag
Shear Strength 15.13 MPa

@Temperature 82.2 °C
 2195 psi

@Temperature 180 °F
 Cure Cycle, 2 hrs @ 250°F, FPL Acid Etched 6061-T6, Std Dev 94; ASTM D1002
17.13 MPa

@Temperature 82.2 °C
 2485 psi

@Temperature 180 °F
 Cure Cycle, 4 hrs @ 220°F, FPL Acid Etched 6061-T6, Std Dev 132; ASTM D1002
17.33 MPa

@Temperature 82.2 °C
 2513 psi

@Temperature 180 °F
 Cure Cycle, 8 hrs @ 180°F, FPL Acid Etched 6061-T6, Std Dev 158; ASTM D1002
19.68 MPa

@Temperature 60.0 °C
 2855 psi

@Temperature 140 °F
 Cure Cycle, 2 hrs @ 250°F, FPL Acid Etched 6061-T6, Std Dev 64; ASTM D1002
21.59 MPa

@Temperature 60.0 °C
 3131 psi

@Temperature 140 °F
 Cure Cycle, 4 hrs @ 220°F, FPL Acid Etched 6061-T6, Std Dev 72; ASTM D1002
22.39 MPa

@Temperature 60.0 °C
 3248 psi

@Temperature 140 °F
 Cure Cycle, 8 hrs @ 180°F, FPL Acid Etched 6061-T6, Std Dev 144; ASTM D1002
22.45 MPa

@Temperature 21.1 °C
 3256 psi

@Temperature 70.0 °F
 Cure Cycle, 8 hrs @ 180°F, FPL Acid Etched 6061-T6, Std Dev 502; ASTM D1002
22.5 MPa

@Temperature 21.1 °C
 3270 psi

@Temperature 70.0 °F
 Cure Cycle, 2 hrs @ 250°F, FPL Acid Etched 6061-T6, Std Dev 470; ASTM D1002
23.30 MPa

@Temperature 60.0 °C
 3379 psi

@Temperature 140 °F
 Cure Cycle, 6 hrs @ 200°F, FPL Acid Etched 6061-T6, Std Dev 100; ASTM D1002
24.1 MPa

@Temperature 82.2 °C
 3490 psi

@Temperature 180 °F
 Cure Cycle, 2 hrs @ 250°F, FPL Acid Etched 6061-T6, Std Dev 121; ASTM D1002
24.1 MPa

@Temperature 82.2 °C
 3500 psi

@Temperature 180 °F
 2 hrs @ 250°F, Metal Clamp Pressure, 6061 T6 FPL Etched
24.29 MPa

@Temperature 21.1 °C
 3523 psi

@Temperature 70.0 °F
 Cure Cycle, 1 hr @ 250°F, FPL Acid Etched 6061-T6, Std Dev 456; ASTM D1002
24.51 MPa

@Temperature 82.2 °C
 3555 psi

@Temperature 180 °F
 Cure Cycle, 6 hrs @ 200°F, FPL Acid Etched 6061-T6, Std Dev 150; ASTM D1002
27.10 MPa

@Temperature 71.1 °C
 3931 psi

@Temperature 160 °F
 Cure Cycle, 2 hrs @ 250°F, FPL Acid Etched 6061-T6, Std Dev 138; ASTM D1002
27.6 MPa

@Temperature 21.1 °C
 4010 psi

@Temperature 70.0 °F
 Cure Cycle, 6 hrs @ 200°F, FPL Acid Etched 6061-T6, Std Dev 109; ASTM D1002
27.9 MPa

@Temperature 60.0 °C
 4040 psi

@Temperature 140 °F
 Cure Cycle, 2 hrs @ 250°F, FPL Acid Etched 6061-T6, Std Dev 117; ASTM D1002
27.97 MPa

@Temperature 21.1 °C
 4056 psi

@Temperature 70.0 °F
 Cure Cycle, 2 hrs @ 250°F, FPL Acid Etched 6061-T6, Std Dev 218; ASTM D1002
28.14 MPa

@Temperature 21.1 °C
 4082 psi

@Temperature 70.0 °F
 Cure Cycle, 4 hrs @ 220°F, FPL Acid Etched 6061-T6, Std Dev 128; ASTM D1002
30.74 MPa

@Temperature 21.1 °C
 4459 psi

@Temperature 70.0 °F
 Cure Cycle, 6 hrs @ 220°F, FPL Acid Etched 6061-T6, Std Dev 134; ASTM D1002
32.30 MPa

@Temperature 21.1 °C
 4685 psi

@Temperature 70.0 °F
 Cure Cycle, 1 hr @ 250°F, FPL Acid Etched 6061-T6, Std Dev 9; ASTM D1002
32.55 MPa

@Temperature 21.1 °C
 4721 psi

@Temperature 70.0 °F
 Cure Cycle, 2 hrs @ 250°F, FPL Acid Etched 6061-T6, Std Dev 128; ASTM D1002
32.73 MPa

@Temperature 21.1 °C
 4747 psi

@Temperature 70.0 °F
 Cure Cycle, 90 min @ 250°F, FPL Acid Etched 6061-T6, Std Dev 84; ASTM D1002
34.5 MPa

@Temperature 21.1 °C
 5000 psi

@Temperature 70.0 °F
 2 hrs @ 250°F, Metal Clamp Pressure, 6061 T6 FPL Etched
35.32 MPa

@Temperature 21.1 °C
 5123 psi

@Temperature 70.0 °F
 Cure Cycle, 90 min @ 250°F, FPL Acid Etched 6061-T6, Std Dev 96; ASTM D1002
Peel Strength 5.33 kN/m
30.4 pli
T-Peel, Cure Cycle, 1 hr @ 250°F, FPL Acid Etched 6061-T6, Std Dev 1.6; ASTM D1876
5.40 kN/m
30.8 pli
T-Peel, Cure Cycle, 6 hrs @ 220°F, FPL Acid Etched 6061-T6, Std Dev 1.9; ASTM D1876
6.28 kN/m
35.8 pli
T-Peel, Cure Cycle, 90 min @ 250°F, FPL Acid Etched 6061-T6, Std Dev 2.3; ASTM D1876
6.82 kN/m
38.9 pli
T-Peel, Cure Cycle, 90 min @ 250°F, FPL Acid Etched 6061-T6, Std Dev 3.1; ASTM D1876
7.10 kN/m
40.5 pli
T-Peel, Cure Cycle, 2 hrs @ 250°F, FPL Acid Etched 6061-T6, Std Dev 3.4; ASTM D1876
3.51 kN/m

@Temperature 82.2 °C
 20.0 pli

@Temperature 180 °F
 T-Peel, 2 hrs @ 250°F, Metal Clamp Pressure, 6061 T6 FPL Etched
7.19 kN/m

@Temperature 21.1 °C
 41.0 pli

@Temperature 70.0 °F
 T-Peel, 2 hrs @ 250°F, Metal Clamp Pressure, 6061 T6 FPL Etched
Descriptive Properties Value Comments
Drum Peel 19.8 in-lb/in
Tool Side Up, 2 hrs @ 250°F, 30 psi, 6061 T6 Abraded, 1” Nomex 3 lb core 1/8” cell
20.5 in-lb/in
Tool Side Down, 2 hrs @ 250°F, 30 psi, 6061 T6 Abraded, 1” Nomex 3 lb core 1/8” cell
Load to Failure 606 lbf
5 lb Core, 6 hrs @ 220°F, Vacuum Bag
669 lbf
8 lb Core, 6 hrs @ 220°F, Vacuum Bag
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