UBE UPISEL-N BE1210 Copper Clad Laminate

Category	Metal , Polymer
Manufacturer	UBE
Trade Name	UPISEL-N
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	UBE UPISEL-N BE1210 Copper Clad Laminate.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

Description: UPISEL-N BE1210 is non-adhesive type flexible Copper Clad Laminate (Polyimide = 25µm, Cu = 18µm) based on "UPILEX-VT." UPISEL-N has excellent dimensional stability and heat resistance. "UPILEX-VT" performs high bonding ability without any use of adhesives by simple heat lamination. "UPILEX-VT" is an aromatic polyimide same as "UPILEX-S" which has high market share as the base film for TAB (Tape Automated Bonding).Applications: FPCTCPMCM-LCOFRigid flexMulti-layer boardsMetal based boardsHigh frequency boardsHeat-resistant boardsIC cardsBoards for automobileElectromagnetic wave shield materialHDD suspensionCharacteristics: Without the use of adhesives, UPISEL-N maintains high physical properties and high reliability at high temperaturesIt performs excellent peeling strength, heat soldering resistance, chemical resistance and dimensional stabilityThe film layer of the UPISEL-N can be heat bonded with ceramics, metals and silicon chipWithout the use of adhesives, UPISEL-N is tender for the environmentInformation provided by UBE.

Physical Properties	Metric	English	Comments
Water Absorption	1.0 %	1.0 %	IPCTM 650

Mechanical Properties	Metric	English	Comments
Elongation at Break	54 %	54 %	ASTM D882
Tensile Modulus	6.67 GPa	967 ksi	ASTM D882
Peel Strength	0.686 kN/m	3.91 pli	T Peel (Width=10), 300°C; IPC-FC-241B
	1.08 kN/m	6.16 pli	90° Peel (Width=10) after 200°C for 7 days; IPC-FC-241B
	1.08 kN/m	6.16 pli	90° Peel (Width=3.2), 100% Retained with 2N-HCl or 2N-NaOH; IPC-FC-241B
	1.275 kN/m	7.275 pli	T Peel (Width=10), 250°C; IPC-FC-241B
	1.37 kN/m	7.82 pli	T Peel (Width=10), 25°C; IPC-FC-241B

Thermal Properties	Metric	English	Comments
Flammability, UL94	V-0	V-0	VTM-0
Shrinkage	0.025 %	0.025 %	After Cu Etching; IPC-FC-241B
	0.060 %	0.060 %	After Cu Etching; IPC-FC-241B
	0.0350 % @Temperature 150 °C, Time 1800 sec	0.0350 % @Temperature 302 °F, Time 0.500 hour	IPC-FC-241B
	0.0800 % @Temperature 150 °C, Time 1800 sec	0.0800 % @Temperature 302 °F, Time 0.500 hour	IPC-FC-241B

Electrical Properties	Metric	English	Comments
Volume Resistivity	>= 5.00e+16 ohm-cm	>= 5.00e+16 ohm-cm	ASTM D257
Surface Resistance	>= 1.00e+14 ohm	>= 1.00e+14 ohm	ASTM D257
Dielectric Constant	3.2 @Frequency 1000 Hz	3.2 @Frequency 1000 Hz	ASTM D150
Dissipation Factor	0.0023 @Frequency 1000 Hz	0.0023 @Frequency 1000 Hz	ASTM D150

Descriptive Properties	Value	Comments
Flexural Endurance (MD)	110,000 cycles	IPC-FC-241B
Flexural Endurance (TD)	150,000 cycles	IPC-FC-241B
Folding Endurance RO.4 (MD)	48 cycles	JPCA FC01
Folding Endurance RO.4 (TD)	48 cycles	JPCA FC01
Hot Solder Resistance: 300°C 1 min.	No Change	IPC-FC-241B

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