| Category | Polymer , Thermoplastic , Polysulfone (PSU) , Polysulfone, 10% Glass Fiber Reinforced |
| Manufacturer | Techmer ES |
| Trade Name | HiFill® |
| Port | Ningbo port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Techmer ES HiFill® PSU GF10 10% Glass Filled.pdf |
| Price | EMAIL US sales@lookpolymers.com |
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Density | 1.31 g/cc | 0.0473 lb/in³ | ASTM D792 |
| Water Absorption | 0.21 % @Time 86400 sec |
0.21 % @Time 24.0 hour |
ASTM D570 |
| Linear Mold Shrinkage, Flow | 0.0040 cm/cm @Thickness 3.17 mm |
0.0040 in/in @Thickness 0.125 in |
ASTM D955 |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Hardness, Rockwell R | 123 | 123 | ASTM D785 |
| Tensile Strength, Yield | 86.2 MPa | 12500 psi | ASTM D638 |
| Elongation at Break | 7.0 % | 7.0 % | ASTM D638 |
| Flexural Yield Strength | 139 MPa | 20200 psi | ASTM D790 |
| Flexural Modulus | 4.14 GPa | 600 ksi | ASTM D790 |
| Izod Impact, Notched | 0.587 J/cm @Thickness 3.17 mm |
1.10 ft-lb/in @Thickness 0.125 in |
ASTM D256 |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear, Parallel to Flow | 30.6 µm/m-°C | 17.0 µin/in-°F | ASTM D696 |
| Deflection Temperature at 1.8 MPa (264 psi) | 183 °C | 362 °F | Unannealed; ASTM D648 |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Volume Resistivity | 1.00e+16 ohm-cm | 1.00e+16 ohm-cm | ASTM D257 |
| Dielectric Strength | 16.9 kV/mm | 430 kV/in | Method A (Short-Time); ASTM D149 |