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Sumitomo Bakelite North America E 9405H-1 Glass Filled Electrical Encapsulation Grade Epoxy

Category Polymer , Thermoset , Epoxy , Epoxy, Encapsulating, Glass or Mineral Filled , Filled/Reinforced Thermoset
Manufacturer Sumitomo Bakelite North America
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Sumitomo Bakelite North America E 9405H-1 Glass Filled Electrical Encapsulation Grade Epoxy.pdf
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Material Notes:
E-9504H-1 is glass fiber filled epoxy molding compound designed for encapsulation of delicate electrical components as well as large coils. Excellent thermal shock, moldability, and retention of electrical properties under humid conditions are the outstanding features of this material.Information provided by Sumitomo Bak North America, Inc.
Physical Properties Metric English Comments
Density 1.70 g/cc
0.0614 lb/in³
ASTM D792
Water Absorption 0.11 %

@Temperature 50.0 °C,
Time 173000 sec
0.11 %

@Temperature 122 °F,
Time 48.0 hour
ASTM D570
Linear Mold Shrinkage 0.0050 - 0.0070 cm/cm
0.0050 - 0.0070 in/in
ASTM D955
Mechanical Properties Metric English Comments
Tensile Strength at Break 82.0 MPa
11900 psi
ASTM D638
Flexural Strength 123 MPa
17800 psi
at rupture; ASTM D790
Flexural Modulus 11.7 GPa
1700 ksi
ASTM D790
Compressive Strength 220 MPa
31900 psi
ASTM D695
Izod Impact, Notched 0.310 J/cm
0.581 ft-lb/in
ASTM D256
Thermal Properties Metric English Comments
CTE, linear, Parallel to Flow 32.0 µm/m-°C
17.8 µin/in-°F
ASTM E831
Electrical Properties Metric English Comments
Dielectric Constant 3.7

@Frequency 1.00e+6 Hz
3.7

@Frequency 1.00e+6 Hz
wet; ASTM D150
Dielectric Strength 12.8 kV/mm

@Frequency 60.0 Hz
325 kV/in

@Frequency 60.0 Hz
step-by-step, wet; ASTM D149
13.3 kV/mm

@Frequency 60.0 Hz
338 kV/in

@Frequency 60.0 Hz
short time, wet; ASTM D149
Dissipation Factor 0.020

@Frequency 1.00e+6 Hz
0.020

@Frequency 1.00e+6 Hz
wet; ASTM D150
Arc Resistance 190 sec
190 sec
ASTM D495
Descriptive Properties Value Comments
Color Black
Form Granular
Molding Method Compression
Transfer
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