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Rogers Corporation Theta® MCL-HE-679G Laminate, GHA-679G Prepreg Halogen-Free, Low Dielectric Constant, High heat Resistant Multi-Layer Circuit Material

Category Polymer
Manufacturer Rogers Corporation
Trade Name Theta®
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Rogers Corporation Theta® MCL-HE-679G Laminate, GHA-679G Prepreg Halogen-Free, Low Dielectric Constant, High heat Resistant Multi-Layer Circuit Material.pdf
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Material Notes:
Theta® circuit materials are halogen free and have good dielectric characteristics suitable for high speed digital applications. Theta materials, in part due to their superior heat resistance, have proven to be extremely reliable through lead free processing and in high layer count HDI design requiring sequential laminations.Features and Benefits:Low insertion loss - Improved signal integrityImproved thermal characteristics - High Tg, suitable for lead free processingSuperior thermal/mechanical reliability - Z-axis CTE 30% lower than standard FR-4Enhanced design flexibility - wide range of laminate and prepreg thickness optionsHalogen free - Environmentally friendly chemistry with no sacrifice to thermal, mechanical or electrical performanceInformation provided by Rogers Corporation.
Physical Properties Metric English Comments
Water Absorption 0.030 - 0.040 %
0.030 - 0.040 %
E-24/50 and D-24/23; IPC-TM-650 2.6.2.1
Mechanical Properties Metric English Comments
Peel Strength 0.799 - 1.10 kN/m
4.56 - 6.28 pli
Copper; 1/2 EDC foil (18 micron); Condition A; IPC-TM-650 2.4.8
Thermal Properties Metric English Comments
CTE, linear 35.0 - 45.0 µm/m-°C

@Temperature <=190 °C
19.4 - 25.0 µin/in-°F

@Temperature <=374 °F
Z-Direction; IPC-TM-650 2.4.24
190 - 220 µm/m-°C

@Temperature >=180 °C
106 - 122 µin/in-°F

@Temperature >=356 °F
Z-Direction; IPC-TM-650 2.4.24
Glass Transition Temp, Tg 180 - 190 °C
356 - 374 °F
TMA; IPC-TM-650 2.4.24
Decomposition Temperature 370 - 390 °C
698 - 734 °F
TGA; 5% weight loss; IPC-TM-650 2.3.40
Flammability, UL94 V-0
V-0
Electrical Properties Metric English Comments
Dielectric Constant 3.79 - 3.96

@Frequency 1.00e+10 Hz
3.79 - 3.96

@Frequency 1.00e+10 Hz
Z direction; IPC-TM-650 2.5.5.5
3.85 - 4.02

@Frequency 1.00e+9 Hz
3.85 - 4.02

@Frequency 1.00e+9 Hz
Z direction; JPCA-TM001
Dissipation Factor 0.0092 - 0.010

@Frequency 1.00e+9 Hz
0.0092 - 0.010

@Frequency 1.00e+9 Hz
Z direction; JPCA-TM001
0.012 - 0.0126

@Frequency 1.00e+10 Hz
0.012 - 0.0126

@Frequency 1.00e+10 Hz
Z direction; IPC-TM-650 2.5.5.5
Descriptive Properties Value Comments
Conductive Anodic Filament Growth > 1000 hrs.
85°C/85% RH, 100 V
Solder Heat Resistance > 300 sec.
260°C, Condition A
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