Rogers Corporation TMM® TMM3 Ceramic Thermoset Polymer Composite

TMM® Thermoset microwave materials are ceramic thermoset polymer composites designed for high plate-thru-hole reliability stripline and microstrip applications. The electrical and mechanical properties of TMM laminates combine many of the benefits of both ceramic and traditional PTFE microwave circuit laminates, without requiring the specialized production techniques common to these materials.Features:Wide range of dielectric constants. Ideal for single material systems on a wide variety of applications.Excellent mechanical properties. Resists creep and cold flow.Exceptionally low thermal coefficient of dielectric constant.Coefficient of thermal expansion matched to copper. High reliability of plated through holes.Resistant to process chemicals. No damage to material during fabrication and assembly processes.Thermoset resin for reliable wirebonding. No specialized production techniques required. TMM 10 and 10i laminates can replace alumina substrates.Lead-free process compatibleTypical Applications:RF and Microwave CircuitryGlobal Positioning Systems AntennasPower Amplifiers and CombinersPatch AntennasFilters and CouplerDielectric Polarizers and LensesSatellite Communication SystemsChip TestersInformation provided by Rogers Corporation.