Category | Polymer , Thermoplastic , Fluoropolymer , PTFE , Polytetrafluoroethylene (PTFE), Glass Filled, Molded |
Manufacturer | Rogers Corporation |
Trade Name | |
Port | Shanghai port,China |
Trade Terms | FOB, CFR, CIF |
Payment Terms | L/C, T/T, Western Union |
Download PDF | Rogers Corporation RT/duroid® 5870 Glass Microfiber Reinforced PTFE High Frequency Laminate.pdf |
Price | EMAIL US sales@lookpolymers.com |
Physical Properties | Metric | English | Comments |
---|---|---|---|
Density | 2.20 g/cc | 0.0795 lb/in³ | ASTM D792 |
Moisture Absorption at Equilibrium | 0.020 % @Thickness 1.57 mm |
0.020 % @Thickness 0.0620 in |
D48/50; ASTM D570 |
Thickness | 127 - 3180 microns | 5.00 - 125 mil | Range of Thicknesses Available |
Mechanical Properties | Metric | English | Comments |
---|---|---|---|
Tensile Strength, Ultimate | 34.0 MPa @Temperature 100 °C |
4930 psi @Temperature 212 °F |
X direction, Condition A; ASTM D638 |
34.0 MPa @Temperature 100 °C |
4930 psi @Temperature 212 °F |
Y direction, Condition A; ASTM D638 | |
42.0 MPa @Temperature 23.0 °C |
6090 psi @Temperature 73.4 °F |
Y direction, Condition A; ASTM D638 | |
50.0 MPa @Temperature 23.0 °C |
7250 psi @Temperature 73.4 °F |
X direction, Condition A; ASTM D638 | |
Elongation at Break | 8.6 % @Temperature 100 °C |
8.6 % @Temperature 212 °F |
Y direction, Condition A; ASTM D638 |
8.7 % @Temperature 100 °C |
8.7 % @Temperature 212 °F |
X direction, Condition A; ASTM D638 | |
9.8 % @Temperature 23.0 °C |
9.8 % @Temperature 73.4 °F |
X direction, Condition A; ASTM D638 | |
9.8 % @Temperature 23.0 °C |
9.8 % @Temperature 73.4 °F |
Y direction, Condition A; ASTM D638 | |
Tensile Modulus | 0.434 GPa @Temperature 100 °C |
63.0 ksi @Temperature 212 °F |
Y direction; ASTM D638 |
0.490 GPa @Temperature 100 °C |
71.0 ksi @Temperature 212 °F |
X direction; ASTM D638 | |
1.28 GPa @Temperature 23.0 °C |
185 ksi @Temperature 73.4 °F |
Y direction; ASTM D638 | |
1.30 GPa @Temperature 23.0 °C |
189 ksi @Temperature 73.4 °F |
X direction; ASTM D638 | |
Compressive Strength | 23.0 MPa @Strain 4.30 %, Temperature 100 °C |
3340 psi @Strain 4.30 %, Temperature 212 °F |
X direction, Condition A; ASTM D695 |
25.0 MPa @Strain 3.30 %, Temperature 100 °C |
3630 psi @Strain 3.30 %, Temperature 212 °F |
Y direction, Condition A; ASTM D695 | |
30.0 MPa @Strain 4.00 %, Temperature 23.0 °C |
4350 psi @Strain 4.00 %, Temperature 73.4 °F |
X direction, Condition A; ASTM D695 | |
37.0 MPa @Strain 3.30 %, Temperature 23.0 °C |
5370 psi @Strain 3.30 %, Temperature 73.4 °F |
Y direction, Condition A; ASTM D695 | |
37.0 MPa @Strain 8.50 %, Temperature 100 °C |
5370 psi @Strain 8.50 %, Temperature 212 °F |
Z direction, Condition A; ASTM D695 | |
54.0 MPa @Strain 8.70 %, Temperature 23.0 °C |
7830 psi @Strain 8.70 %, Temperature 73.4 °F |
Z direction, Condition A; ASTM D695 | |
Compressive Modulus | 0.520 GPa @Temperature 100 °C |
75.4 ksi @Temperature 212 °F |
Z direction, Condition A; ASTM D695 |
0.680 GPa @Temperature 100 °C |
98.6 ksi @Temperature 212 °F |
X direction, Condition A; ASTM D695 | |
0.803 GPa @Temperature 23.0 °C |
116 ksi @Temperature 73.4 °F |
Z direction, Condition A; ASTM D695 | |
0.860 GPa @Temperature 100 °C |
125 ksi @Temperature 212 °F |
Y direction, Condition A; ASTM D695 | |
1.21 GPa @Temperature 23.0 °C |
175 ksi @Temperature 73.4 °F |
X direction, Condition A; ASTM D695 | |
1.36 GPa @Temperature 23.0 °C |
197 ksi @Temperature 73.4 °F |
Y direction, Condition A; ASTM D695 | |
Peel Strength | 4.77 kN/m | 27.2 pli | 1 oz EDC foil; after solder float; IPC-TM-650 2.4.8 |
Thermal Properties | Metric | English | Comments |
---|---|---|---|
CTE, linear | 22.0 µm/m-°C @Temperature 0.000 - 100 °C |
12.2 µin/in-°F @Temperature 32.0 - 212 °F |
X-Direction; IPC-TM-650 2.4.41 |
28.0 µm/m-°C @Temperature 0.000 - 100 °C |
15.6 µin/in-°F @Temperature 32.0 - 212 °F |
Y-Direction; IPC-TM-650 2.4.41 | |
173 µm/m-°C @Temperature 0.000 - 100 °C |
96.1 µin/in-°F @Temperature 32.0 - 212 °F |
Z-Direction; IPC-TM-650 2.4.41 | |
Specific Heat Capacity | 0.960 J/g-°C | 0.229 BTU/lb-°F | calculated |
Thermal Conductivity | 0.220 W/m-K @Temperature 80.0 °C |
1.53 BTU-in/hr-ft²-°F @Temperature 176 °F |
Z direction; ASTM C518 |
Deflection Temperature at 1.8 MPa (264 psi) | >= 260 °C | >= 500 °F | X, Y direction; ASTM D648 |
Decomposition Temperature | 500 °C | 932 °F | TGA; ASTM D3850 |
Flammability, UL94 | V-0 | V-0 |
Electrical Properties | Metric | English | Comments |
---|---|---|---|
Volume Resistivity | 2.00e+13 ohm-cm | 2.00e+13 ohm-cm | Z direction; C96/35/90; ASTM D257 |
Surface Resistance | 2.00e+13 ohm | 2.00e+13 ohm | Z direction; C96/35/90; ASTM D257 |
Dielectric Constant | 2.31 - 2.35 @Frequency 1.00e+10 Hz |
2.31 - 2.35 @Frequency 1.00e+10 Hz |
Process; Z direction; C24/23/50; IPC-TM-650 2.5.5.5 |
2.33 @Frequency 8.00e+9 - 4.00e+10 Hz |
2.33 @Frequency 8.00e+9 - 4.00e+10 Hz |
Design; Z direction; C24/23/50; IPC-TM-650 2.5.5.5 | |
Dissipation Factor | 0.00050 @Frequency 1.00e+6 Hz |
0.00050 @Frequency 1.00e+6 Hz |
Z direction; C24/23/50; IPC-TM-650 2.5.5.3 |
0.0012 @Frequency 1.00e+10 Hz |
0.0012 @Frequency 1.00e+10 Hz |
Z direction; C24/23/50; IPC-TM-650 2.5.5.5 |
Descriptive Properties | Value | Comments |
---|---|---|
Thermal Coefficient of Dielectric Constant | -115 ppm/°C | IPC-TM-650 2.5.5.5; -50°C to 150°C |