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Rogers Corporation RT/duroid® 5870 Glass Microfiber Reinforced PTFE High Frequency Laminate

Category Polymer , Thermoplastic , Fluoropolymer , PTFE , Polytetrafluoroethylene (PTFE), Glass Filled, Molded
Manufacturer Rogers Corporation
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Rogers Corporation RT/duroid® 5870 Glass Microfiber Reinforced PTFE High Frequency Laminate.pdf
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Material Notes:
RT/duroid® 5870 and 5880 glass microfiber reinforced PTFE composites are designed for exacting stripline and microstrip circuit applications. Glass reinforcing microfibers are randomly oriented to maximize benefits of fiber reinforcement in the directions most valuable to circuit producers and in the final circuit applications.The dielectric constant of RT/duroid laminates is uniform from panel to panel and is constant over a wide frequency range. Its low dissipation factor extends the usefulness of RT/duroid 5870 and 5880 laminates to Ku-band and above.RT/duroid 5870 and 5880 laminates are easily cut, sheared and machined to shape. They are resistant to all solvents and reagents, hot or cold, normally used in etching printed circuits or in plating edges and holes.Available with a range of copper cladding options.Features:Lowest electrical loss for reinforced PTFE materialLow moisture absorptionIsotropicUniform electrical properties over frequencyExcellent chemical resistanceLead free process compatibleTypical Applications:Commercial Airline TelephonesMicrostrip and Stripline CircuitsMillimeter Wave ApplicationsMilitary Radar SystemsMissile Guidance SystemsPoint to Point Digital Radio AntennasInformation provided by Rogers Corporation.
Physical Properties Metric English Comments
Density 2.20 g/cc
0.0795 lb/in³
ASTM D792
Moisture Absorption at Equilibrium 0.020 %

@Thickness 1.57 mm
0.020 %

@Thickness 0.0620 in
D48/50; ASTM D570
Thickness 127 - 3180 microns
5.00 - 125 mil
Range of Thicknesses Available
Mechanical Properties Metric English Comments
Tensile Strength, Ultimate 34.0 MPa

@Temperature 100 °C
4930 psi

@Temperature 212 °F
X direction, Condition A; ASTM D638
34.0 MPa

@Temperature 100 °C
4930 psi

@Temperature 212 °F
Y direction, Condition A; ASTM D638
42.0 MPa

@Temperature 23.0 °C
6090 psi

@Temperature 73.4 °F
Y direction, Condition A; ASTM D638
50.0 MPa

@Temperature 23.0 °C
7250 psi

@Temperature 73.4 °F
X direction, Condition A; ASTM D638
Elongation at Break 8.6 %

@Temperature 100 °C
8.6 %

@Temperature 212 °F
Y direction, Condition A; ASTM D638
8.7 %

@Temperature 100 °C
8.7 %

@Temperature 212 °F
X direction, Condition A; ASTM D638
9.8 %

@Temperature 23.0 °C
9.8 %

@Temperature 73.4 °F
X direction, Condition A; ASTM D638
9.8 %

@Temperature 23.0 °C
9.8 %

@Temperature 73.4 °F
Y direction, Condition A; ASTM D638
Tensile Modulus 0.434 GPa

@Temperature 100 °C
63.0 ksi

@Temperature 212 °F
Y direction; ASTM D638
0.490 GPa

@Temperature 100 °C
71.0 ksi

@Temperature 212 °F
X direction; ASTM D638
1.28 GPa

@Temperature 23.0 °C
185 ksi

@Temperature 73.4 °F
Y direction; ASTM D638
1.30 GPa

@Temperature 23.0 °C
189 ksi

@Temperature 73.4 °F
X direction; ASTM D638
Compressive Strength 23.0 MPa

@Strain 4.30 %,
Temperature 100 °C
3340 psi

@Strain 4.30 %,
Temperature 212 °F
X direction, Condition A; ASTM D695
25.0 MPa

@Strain 3.30 %,
Temperature 100 °C
3630 psi

@Strain 3.30 %,
Temperature 212 °F
Y direction, Condition A; ASTM D695
30.0 MPa

@Strain 4.00 %,
Temperature 23.0 °C
4350 psi

@Strain 4.00 %,
Temperature 73.4 °F
X direction, Condition A; ASTM D695
37.0 MPa

@Strain 3.30 %,
Temperature 23.0 °C
5370 psi

@Strain 3.30 %,
Temperature 73.4 °F
Y direction, Condition A; ASTM D695
37.0 MPa

@Strain 8.50 %,
Temperature 100 °C
5370 psi

@Strain 8.50 %,
Temperature 212 °F
Z direction, Condition A; ASTM D695
54.0 MPa

@Strain 8.70 %,
Temperature 23.0 °C
7830 psi

@Strain 8.70 %,
Temperature 73.4 °F
Z direction, Condition A; ASTM D695
Compressive Modulus 0.520 GPa

@Temperature 100 °C
75.4 ksi

@Temperature 212 °F
Z direction, Condition A; ASTM D695
0.680 GPa

@Temperature 100 °C
98.6 ksi

@Temperature 212 °F
X direction, Condition A; ASTM D695
0.803 GPa

@Temperature 23.0 °C
116 ksi

@Temperature 73.4 °F
Z direction, Condition A; ASTM D695
0.860 GPa

@Temperature 100 °C
125 ksi

@Temperature 212 °F
Y direction, Condition A; ASTM D695
1.21 GPa

@Temperature 23.0 °C
175 ksi

@Temperature 73.4 °F
X direction, Condition A; ASTM D695
1.36 GPa

@Temperature 23.0 °C
197 ksi

@Temperature 73.4 °F
Y direction, Condition A; ASTM D695
Peel Strength 4.77 kN/m
27.2 pli
1 oz EDC foil; after solder float; IPC-TM-650 2.4.8
Thermal Properties Metric English Comments
CTE, linear 22.0 µm/m-°C

@Temperature 0.000 - 100 °C
12.2 µin/in-°F

@Temperature 32.0 - 212 °F
X-Direction; IPC-TM-650 2.4.41
28.0 µm/m-°C

@Temperature 0.000 - 100 °C
15.6 µin/in-°F

@Temperature 32.0 - 212 °F
Y-Direction; IPC-TM-650 2.4.41
173 µm/m-°C

@Temperature 0.000 - 100 °C
96.1 µin/in-°F

@Temperature 32.0 - 212 °F
Z-Direction; IPC-TM-650 2.4.41
Specific Heat Capacity 0.960 J/g-°C
0.229 BTU/lb-°F
calculated
Thermal Conductivity 0.220 W/m-K

@Temperature 80.0 °C
1.53 BTU-in/hr-ft²-°F

@Temperature 176 °F
Z direction; ASTM C518
Deflection Temperature at 1.8 MPa (264 psi) >= 260 °C
>= 500 °F
X, Y direction; ASTM D648
Decomposition Temperature 500 °C
932 °F
TGA; ASTM D3850
Flammability, UL94 V-0
V-0
Electrical Properties Metric English Comments
Volume Resistivity 2.00e+13 ohm-cm
2.00e+13 ohm-cm
Z direction; C96/35/90; ASTM D257
Surface Resistance 2.00e+13 ohm
2.00e+13 ohm
Z direction; C96/35/90; ASTM D257
Dielectric Constant 2.31 - 2.35

@Frequency 1.00e+10 Hz
2.31 - 2.35

@Frequency 1.00e+10 Hz
Process; Z direction; C24/23/50; IPC-TM-650 2.5.5.5
2.33

@Frequency 8.00e+9 - 4.00e+10 Hz
2.33

@Frequency 8.00e+9 - 4.00e+10 Hz
Design; Z direction; C24/23/50; IPC-TM-650 2.5.5.5
Dissipation Factor 0.00050

@Frequency 1.00e+6 Hz
0.00050

@Frequency 1.00e+6 Hz
Z direction; C24/23/50; IPC-TM-650 2.5.5.3
0.0012

@Frequency 1.00e+10 Hz
0.0012

@Frequency 1.00e+10 Hz
Z direction; C24/23/50; IPC-TM-650 2.5.5.5
Descriptive Properties Value Comments
Thermal Coefficient of Dielectric Constant -115 ppm/°C
IPC-TM-650 2.5.5.5; -50°C to 150°C
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