Reltek BONDiT™ B-52 Adhesive, Sealant & Potting System

Category	Polymer , Adhesive , Thermoset
Manufacturer	Reltek LLC
Trade Name	BONDiT™
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Reltek BONDiT™ B-52 Adhesive, Sealant & Potting System.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Key Properties: Outstanding for bonding dissimilar materials with high thermal expansion differential applications.Fast thermal cure, long pot life.Ease of use.Applications: Excellent for fast assembly of dissimilar materials with large differentials in thermal expansion, such as glass to acrylic. Bonds most plastics, metals, glass, and ceramics. Cure 10 minutes at 170°F.

Physical Properties	Metric	English	Comments
Viscosity	1500 cP	1500 cP

Mechanical Properties	Metric	English	Comments
Tensile Strength at Break	13.05 MPa	1893 psi	ASTM D638
Tensile Strength, Ultimate	13.11 MPa	1902 psi	ASTM D638
Tensile Strength, Yield	13.11 MPa	1902 psi	ASTM D638
Elongation at Break	8.2 %	8.2 %	ASTM D638
Elongation at Yield	8.2 %	8.2 %	ASTM D638
Tangent Modulus	927.0 MPa	134400 psi	ASTM D638

Processing Properties	Metric	English	Comments
Pot Life	30 - 40 min	30 - 40 min	Ambient

Descriptive Properties	Value	Comments
Color	Clear with slight amber
Flexibility Ranking	3	0=Rigid, 5=Highly Flexible

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