Parker Chomerics Tecknit Teckfip™ HC FIP-C Formed in Place Conductive Elastomer

Category	Polymer
Manufacturer	Parker Chomerics Tecknit
Trade Name	Teckfip™
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Parker Chomerics Tecknit Teckfip™ HC FIP-C Formed in Place Conductive Elastomer.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

Description: Heat cure compound. This compound is an all round high performance compound, and is very similar to a Consil C molded or extruded elastomer. It has been traditionally used for telecommunications base station shielding. This material has excellent adhesive strength, and the electrical conductivity remains stable even under long term mechanical load such as vibration or periodic loading and temperature fluctuations.Information provided by Chomerics

Physical Properties	Metric	English	Comments
Specific Gravity	2.23 - 2.99 g/cc	2.23 - 2.99 g/cc

Mechanical Properties	Metric	English
Hardness, Shore A	45 - 55	45 - 55
Tensile Strength	>= 1.38 MPa	>= 200 psi
Elongation at Break	>= 50 %	>= 50 %
Peel Strength	>= 9.00 kN/m	>= 51.4 pli
Compression Set	10 - 25 %	10 - 25 %
	27 % @Temperature 70.0 °C, Time 79200 sec	27 % @Temperature 158 °F, Time 22.0 hour

Thermal Properties	Metric	English	Comments
Maximum Service Temperature, Air	125 °C	257 °F
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F

Electrical Properties	Metric	English
Volume Resistivity	<= 0.010 ohm-cm	<= 0.010 ohm-cm
Surface Resistance	<= 0.010 ohm	<= 0.010 ohm
	<= 0.030 ohm @Temperature 85.0 °C, Time 605000 sec	<= 0.030 ohm @Temperature 185 °F, Time 168 hour

Processing Properties	Metric	English	Comments
Cure Time	60.0 min @Temperature 125 °C	1.00 hour @Temperature 257 °F
Shelf Life	1.00 Month	1.00 Month	Syringe
	6.00 Month	6.00 Month	Cartridge

Descriptive Properties	Value	Comments
Color	Gray
Filler	Silver/Copper Heat Cure

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