Parker Chomerics Tecknit TeckBond™-C Silver-Plated Copper-Filled Adhesive

Description: TECKBOND-C is a silicone rubber base filled with silver-plated copper particles to produce a highly conductive one-component adhesive sealant. The system is an RTV moisture-cured compound which is ready to use without additional preparation or mixing. The compound cures at room temperature to form a flexible resilient conductive bond or sealant.Application Information: TECKBOND conductive adhesive-sealants are recommended wherever a flexible bond is required in a metal-to-silicone gasket application, such as TECKNIT CONSIL®-C. These adhesives are recommended in applications where the bond thickness is less than 0.016 in. [0.4 mm]. To ensure optimum bond performance, the surface of the metal may require primingInformation provided by Chomerics