Parker Chomerics Tecknit TeckBond™-C Silver-Plated Copper-Filled Adhesive

Category	Polymer , Adhesive
Manufacturer	Parker Chomerics Tecknit
Trade Name	TeckBond™-C
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Parker Chomerics Tecknit TeckBond™-C Silver-Plated Copper-Filled Adhesive.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Description: TECKBOND-C is a silicone rubber base filled with silver-plated copper particles to produce a highly conductive one-component adhesive sealant. The system is an RTV moisture-cured compound which is ready to use without additional preparation or mixing. The compound cures at room temperature to form a flexible resilient conductive bond or sealant.Application Information: TECKBOND conductive adhesive-sealants are recommended wherever a flexible bond is required in a metal-to-silicone gasket application, such as TECKNIT CONSIL®-C. These adhesives are recommended in applications where the bond thickness is less than 0.016 in. [0.4 mm]. To ensure optimum bond performance, the surface of the metal may require primingInformation provided by Chomerics

Mechanical Properties	Metric	English	Comments
Shear Strength	>= 1.38 MPa	>= 200 psi	Cured; ASTM D1002
Peel Strength	>= 0.438 kN/m	>= 2.50 pli	Silicone Aluminum; Cured; ASTM D1876

Thermal Properties	Metric	English	Comments
Maximum Service Temperature, Air	182 °C	360 °F	Cured
Minimum Service Temperature, Air	-65.0 °C	-85.0 °F	Cured
Shrinkage	<= 1.0 %	<= 1.0 %	Cured

Electrical Properties	Metric	English	Comments
Volume Resistivity	<= 0.040 ohm-cm @Temperature 25.0 °C	<= 0.040 ohm-cm @Temperature 77.0 °F	50% RH; Cured; QA-1038

Processing Properties	Metric	English	Comments
Cure Time	4320 min @Temperature 25.0 °C	72.0 hour @Temperature 77.0 °F	50%; Recommended for 1/8" dia bead
	10100 min @Temperature 25.0 °C	168 hour @Temperature 77.0 °F	50%; Full Cure
Shelf Life	9.00 Month	9.00 Month	Unopened Container

Descriptive Properties	Value	Comments
Color	Gray
Consistency	Thick Paste
Filler	Ag/Cu
Final Condition	Flexible
Number of Components	One + primer
Resin	Silicone

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