Parker Chomerics CHO-FOIL CCK Shielding Tape

Category	Polymer , Adhesive , Tape
Manufacturer	Parker Chomerics
Trade Name	CHO-FOIL
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Parker Chomerics CHO-FOIL CCK Shielding Tape.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

Conductive Adhesive Tin-plated Copper FoilDescription: Chomerics’ CHO-FOIL® tapes are an economical EMI shielding solution for a variety of commercial uses. The tapes are available in copper, aluminum, or tinned copper foil backed with Chomerics’ highly conductive pressure-sensitive adhesive.Typical Applications: Provide a low impedance connection between a braided cable shield and the metal connector backshell in molded cables. An effective EMI shielded assembly can be achieved without soldering the tape to the braid or backshell; EMI radiation measurement troubleshooting, using CHO-FOIL tape to shield ventilation slots or seam gaps; Provide electrical continuity in seams of EMI shielded rooms and electronic enclosures; Supply electrical contact to surfaces that can’t be soldered to, such as conductive plastic or aluminum; EMI shield for cables by wrapping the tape around the cable. An overlap is recommended; ESD shielding; Provide corrosion-resistant ground contact points; Fabric tape available where weight and flexibility are important, such as for wrapping cables. Information provided by Chomerics

Physical Properties	Metric	English	Comments
Thickness	38.1 microns	1.50 mil	Adhesive thickness
	40.6 microns	1.60 mil	Foil thickness
	78.7 microns	3.10 mil	Total

Mechanical Properties	Metric	English	Comments
Peel Strength	0.508 kN/m	2.90 pli	ASTM D1000
	0.859 kN/m @Temperature 85.0 °C	4.90 pli @Temperature 185 °F	95% RH; ASTM D1000
	0.561 kN/m @Temperature 121 °C, Time 605000 sec	3.20 pli @Temperature 250 °F, Time 168 hour	ASTM D1000
	0.736 kN/m @Temperature 85.0 °C, Time 605000 sec	4.20 pli @Temperature 185 °F, Time 168 hour	ASTM D1000
	0.841 kN/m @Time 605000 sec	4.80 pli @Time 168 hour	Salt fog corrosion; ASTM D1000
Taber Abrasion, mg/1000 Cycles	<= 6.0	<= 6.0	500 gramweight. CS-10 wheel, 500 cycles; CHO-TP-57

Thermal Properties	Metric	English	Comments
Maximum Service Temperature, Air	205 °C	401 °F
Minimum Service Temperature, Air	-40.0 °C	-40.0 °F

Electrical Properties	Metric	English	Comments
Surface Resistance	<= 0.0020 ohm	<= 0.0020 ohm	Initial Surface Resistivity (SR); CHO-TP-57
	<= 0.0020 ohm	<= 0.0020 ohm	Initial through resistivity (TR); CHO-TP-57
	<= 0.0090 ohm	<= 0.0090 ohm	Initial Taber Abrasion; CHO-TP-57
	<= 0.0020 ohm @Temperature 85.0 °C	<= 0.0020 ohm @Temperature 185 °F	95% RH; (SR); CHO-TP-57
	<= 0.0020 ohm @Temperature 85.0 °C	<= 0.0020 ohm @Temperature 185 °F	95% RH; (TR); CHO-TP-57
	<= 0.0020 ohm @Temperature 85.0 °C, Time 605000 sec	<= 0.0020 ohm @Temperature 185 °F, Time 168 hour	(SR); CHO-TP-57
	<= 0.0020 ohm @Temperature 85.0 °C, Time 605000 sec	<= 0.0020 ohm @Temperature 185 °F, Time 168 hour	(TR); CHO-TP-57
	<= 0.0020 ohm @Temperature 121 °C, Time 605000 sec	<= 0.0020 ohm @Temperature 250 °F, Time 168 hour	(SR); CHO-TP-57
	<= 0.0020 ohm @Temperature 121 °C, Time 605000 sec	<= 0.0020 ohm @Temperature 250 °F, Time 168 hour	(TR); CHO-TP-57
	<= 0.0020 ohm @Time 605000 sec	<= 0.0020 ohm @Time 168 hour	Salt fog corrosion; (SR); CHO-TP-57
	<= 0.0020 ohm @Time 605000 sec	<= 0.0020 ohm @Time 168 hour	Salt fog corrosion; (TR); CHO-TP-57
Surface Resistivity per Square	<= 0.0030 ohm	<= 0.0030 ohm	[ohm/in<sup>2<sup>]; <.0005 ohm/cm<sup>2</sup>; MIL-STD-202C

Descriptive Properties	Value	Comments
Adhesion to Aluminum	>40 oz./inch	ASTM D1000
Adhesive Type	Electrically Conductive, Pressure-Sensitive Acrylic
Flame Resistance (UL Subject 510)	Pass
Foil/Fabric Type	1 oz. Tin-Plated Copper

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