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Parker Chomerics CHO-BOND 2167 Part A Conductive Silicone
| Category | Polymer , Adhesive , Thermoset , Silicone |
| Manufacturer | Parker Chomerics |
| Trade Name | CHO-BOND |
| Port | Shanghai port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Parker Chomerics CHO-BOND 2167 Part A Conductive Silicone.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
components are that of coatingInformation provided by Chomerics
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Specific Gravity | >= 1.00 g/cc | >= 1.00 g/cc |
| Component Elements Properties | Metric | English | Comments |
|---|---|---|---|
| Copper, Cu | <= 70 % | <= 70 % | |
| Silver, Ag | <= 10 % | <= 10 % |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Color | Beige | |
| Fluorosilicone Proprietary wt. % Max | 40 | |
| Glass | <5% | |
| Octamethyltrisiloxane wt. % Max | 5 |
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