- HOME
- POLYMER SEARCH
- Additive/Filler for Polymer
- Parker Chomerics CHO-BOND 1053, Part A Conductive Powder
Parker Chomerics CHO-BOND 1053, Part A Conductive Powder
| Category | Other Engineering Material , Additive/Filler for Polymer |
| Manufacturer | Parker Chomerics |
| Trade Name | CHO-BOND |
| Port | Shanghai port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Parker Chomerics CHO-BOND 1053, Part A Conductive Powder.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
Information provided by Chomerics
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Specific Gravity | >= 2.00 g/cc | >= 2.00 g/cc |
| Component Elements Properties | Metric | English | Comments |
|---|---|---|---|
| Silver, Ag | <= 15 % | <= 15 % |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Glass | >85% |
Users viewing this material also viewed the following:
- Nye Lubricants 227(SO) Synthetic Oil
- LG Chemical AF342F ABS, Flame Retardant, High Flow
- Mid-Mountain Materials HYTEX® 1400 Fiberglass Industrial Textile
- SGL Carbon Group EK 2200 Carbon Graphite
- SABIC Innovative Plastics LNP STAT-LOY KX05015 Acetal Copolymer (Europe-Africa-Middle East)
- SGL Carbon Group SIGRAFIL C® C25 M250 UNS Milled Carbon Fiber, Unsized Carbon Fiber
- Total PPH 4054 Polypropylene Homopolymer
- NOVA Chemicals Novapol® HB-W558-A HDPE Extrusion Resin (discontinued **)
Copyright © lookpolymers.com All Rights Reserved