| Category | Polymer , Adhesive |
| Manufacturer | Lord Adhesives |
| Trade Name | Metech |
| Port | Ningbo port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Lord Adhesives Metech 3542 Platinum Silver Conductor Composition.pdf |
| Price | EMAIL US sales@lookpolymers.com |
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Brookfield Viscosity | 180000 - 220000 cP @Temperature 25.0 °C |
180000 - 220000 cP @Temperature 77.0 °F |
HBT, Spindle #SC4-14 @ 10rpm |
| Thickness | 12.0 - 14.0 microns | 0.472 - 0.551 mil | Fired |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Surface Resistivity per Square | 0.011 ohm | 0.011 ohm |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Shelf Life | 12.0 Month @Temperature 25.0 °C |
12.0 Month @Temperature 77.0 °F |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Adhesion | 3-4 | lbs; aged |
| 5-6 | lbs; initial | |
| Coverage (cm²/gm) | 70-75 | Calculated from 50 micron wet film |
| Line Resolution (microns) | 125 | |
| Solder Leach Resistance (cycles) | 5 | Number of 5-second cycles required to leach 50% of a 10 mil wide conductive line using 62Sn/36Pb/2Ag at 230ºC |
| Solder Wetting (seconds) | < 3 | Time required to 100% solder wet 0.08" x 0.08" pad size using 62Sn/36Pb/2Ag at 230ºC |