Lord Adhesives Metech 1130C Platinum Silver Conductor Composition

Category	Polymer , Adhesive
Manufacturer	Lord Adhesives
Trade Name	Metech
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Lord Adhesives Metech 1130C Platinum Silver Conductor Composition.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

This low cost, platinum silver conductor is designed for general hybrid applications. It employs advanced powders technology with a mix bonded frit system to yield a highly dense film that is resistant to solder leaching. It also exhibits excellent adhesion to beryllium oxide substrates.All information provided by Lord.

Physical Properties	Metric	English	Comments
Brookfield Viscosity	160000 - 220000 cP @Temperature 25.0 Â°C	160000 - 220000 cP @Temperature 77.0 Â°F	HBT, Spindle #SC4-14 @ 10rpm
Thickness	11.0 - 13.0 microns	0.433 - 0.512 mil	Fired

Electrical Properties	Metric	English	Comments
Surface Resistivity per Square	<= 0.0025 ohm	<= 0.0025 ohm

Processing Properties	Metric	English	Comments
Shelf Life	12.0 Month @Temperature 25.0 Â°C	12.0 Month @Temperature 77.0 Â°F

Descriptive Properties	Value	Comments
Adhesion	3-4	lbs; aged (500hrs. at 150ÂºC)
	4-5	lbs; initial
Coverage (cmÂ²/gm)	70-75	Calculated from 50 micron wet film
Line Resolution (microns)	125
Solder Leach Resistance (cycles)	5	Number of 5-second cycles required to leach 50% of a 10 mil wide conductive line using 62Sn/36Pb/2Ag at 230ÂºC
Solder Wetting (seconds)	< 3	Time required to 100% solder wet 0.08" x 0.08" pad size using 62Sn/36Pb/2Ag at 230ÂºC

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