Material Notes:
Surface Mount AdhesivesLoctite® Chipbonder® Surface Mount Adhesives (SMAs) maintain component positioning during wave solder and solder reflow processes. Loctite offers a variety of application techniques including syringe dispense, stencil print and pin transfer.Loctite® syringe dispense products provide good performance for electronics assembly:High Speed DispenseLow Temperature CureProducts for difficult-to-bond substratesLoctite® 348 CHIPBONDER® General Purpose, Syringe DispenseA general purpose syringe dispense adhesive for dot placement up to 18,000 per hour. Good green strength.Peaked dot profile. Process Method:Medium speedSyringe dispensing18,000 DPH capableStorage (Protect from heat): 40°F (+/-5°F) or 5°C (+/-3°C)