Material Notes:
Gasketing and Wire TackersLoctite® innovative gasketing products offer precise, reliable sealing of electronic enclosures, protecting them from environmental hazards. Loctite offers both Form-in-place (FIP) and Cure-in-Place (CIP) compression gasket materials.Loctite® Tak Pak Adhesives are used to secure wires to printed circuit board assemblies. The fast cure times of these adhesives help increase the throughput of the wire tacking assembly process.Loctite® 5145 Form-In-Place Adhesive/SealantA high strength, non-corrosive form-in-place silicone adhesive for bonding and sealing electrical devices. This translucent, RTV cure paste complies to Mil-A-46146B, Group II, Type I. Cure Type: Moisture Bonding Type: Silicone Mil A 46146B Group II, Type I