Hexcel® Redux® 610W (0.09 psf) Flame retarded epoxy film adhesive

Category	Polymer , Adhesive , Film , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer	Hexcel
Trade Name
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Hexcel® Redux® 610W (0.09 psf) Flame retarded epoxy film adhesive.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

Redux 610 is a modified, flame-retarded epoxy film adhesive curing at 250°F. It is suitable for bonding metal to metal and for sandwich structures where flame retardancy and low heat release are required. Redux 610 is a hot melt film which is free from solvents and consequently has a very low volatile content.Features: Cures in 1 hour at 250°F; Good lap-shear performance up to 212°F; Good peel performance in sandwich structures up to 175°F; Meets the heat release requirements of IMO test MSC 61 (67); Good tack, drape and handleability; Very low volatile content and low out gassing properties; Available unsupported or with a very lightweight glass carrier.Applications: Metal to metal bonding; Sandwich constructions; Flame retarded performance

Physical Properties	Metric	English	Comments
Storage Temperature	-17.8 °C	0.000 °F

Processing Properties	Metric	English	Comments
Shelf Life	18.0 Month @Temperature -17.8 °C	18.0 Month @Temperature 0.000 °F

Descriptive Properties	Value	Comments
Areal Weight (psf)	0.09
Roll Width (in)	49
Standard Roll (ft2)	1075
Support	Woven Glass

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