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Hexcel® Redux® 322 Modified epoxy film adhesive (0.05 psf)

Category Polymer , Adhesive , Film , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Hexcel
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Hexcel® Redux® 322 Modified epoxy film adhesive (0.05 psf).pdf
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Material Notes:
Redux 322 is a high performance modified epoxy film adhesive curing at 350°F. It is suitable for bonding metal to metal and for sandwich structures, where operating temperatures are experienced up to 430°F for short periods, or 390°F for continuous operation. Redux 322 is a hot melt film which is free from solvents and consequently has a very low volatile content.Features: Cure at 350°F; Good co-cure potential with 350°F curing prepregs; Good hot lap shear performance; Good high temperature performance in metal sandwich structures; Low volatile content and low out gassing properties; Available with or without a woven nylon carrier.Applications: Metal to metal bonding; Sandwich constructions.
Physical Properties Metric English Comments
Outgassing - Total Mass Loss 0.41 %
0.41 %
Recovered Mass Loss (RML), Typical result; ESA PSS-01-702
1.74 %
1.74 %
Total Mass Loss (TML), Typical result; ESA PSS-01-702
Collected Volatile Condensable Material 0.00 %
0.00 %
ESA PSS-01-702
Mechanical Properties Metric English Comments
Shear Strength 20.99 MPa

@Temperature 21.1 °C
3045 psi

@Temperature 70.0 °F
Lap Shear
20.99 MPa

@Temperature 149 °C
3045 psi

@Temperature 300 °F
Lap Shear
Processing Properties Metric English Comments
Shelf Life 18.0 Month

@Temperature -17.8 °C
18.0 Month

@Temperature 0.000 °F
Descriptive Properties Value Comments
Areal Weight (psf) 0.05
Climbing Drum Peel (in-lb/3in) 50.2
70°F; Based on prepreg skins and HexWeb® HRH10-3.2-64
Roll Width (in) 21
Standard Roll (ft2) 430
Support Woven nylon carrier
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