Hexcel® Redux® 322 Modified epoxy film adhesive (0.05 psf)

Category	Polymer , Adhesive , Film , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer	Hexcel
Trade Name
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Hexcel® Redux® 322 Modified epoxy film adhesive (0.05 psf).pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

Redux 322 is a high performance modified epoxy film adhesive curing at 350°F. It is suitable for bonding metal to metal and for sandwich structures, where operating temperatures are experienced up to 430°F for short periods, or 390°F for continuous operation. Redux 322 is a hot melt film which is free from solvents and consequently has a very low volatile content.Features: Cure at 350°F; Good co-cure potential with 350°F curing prepregs; Good hot lap shear performance; Good high temperature performance in metal sandwich structures; Low volatile content and low out gassing properties; Available with or without a woven nylon carrier.Applications: Metal to metal bonding; Sandwich constructions.

Physical Properties	Metric	English	Comments
Outgassing - Total Mass Loss	0.41 %	0.41 %	Recovered Mass Loss (RML), Typical result; ESA PSS-01-702
	1.74 %	1.74 %	Total Mass Loss (TML), Typical result; ESA PSS-01-702
Collected Volatile Condensable Material	0.00 %	0.00 %	ESA PSS-01-702

Mechanical Properties	Metric	English	Comments
Shear Strength	20.99 MPa @Temperature 21.1 °C	3045 psi @Temperature 70.0 °F	Lap Shear
	20.99 MPa @Temperature 149 °C	3045 psi @Temperature 300 °F	Lap Shear

Processing Properties	Metric	English	Comments
Shelf Life	18.0 Month @Temperature -17.8 °C	18.0 Month @Temperature 0.000 °F

Descriptive Properties	Value	Comments
Areal Weight (psf)	0.05
Climbing Drum Peel (in-lb/3in)	50.2	70°F; Based on prepreg skins and HexWeb® HRH10-3.2-64
Roll Width (in)	21
Standard Roll (ft2)	430
Support	Woven nylon carrier

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