Hexcel® Redux® 312/5 Modified epoxy film adhesive

Category	Polymer , Adhesive , Film , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer	Hexcel
Trade Name
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Hexcel® Redux® 312/5 Modified epoxy film adhesive.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Redux® 312 is a high-strength 250°F curing film adhesive, suitable for metal to metal bonding and sandwich constructions, where operating temperatures of up to 210°F may be experienced. A supported version, Redux® 312/5, is available with a woven nylon carrier for bond line thickness control.Features: Short cure cycle - cures in 30 minutes at 250°F; Good mechanical performance up to 210°F; Suitable for composite to composite bonding; Low volatile content (solventless process).Applications: Metal to metal bonding; Sandwich constructions; Composite to composite bonding.

Mechanical Properties	Metric	English	Comments
Tensile Strength, Yield	8.62 MPa @Temperature 21.1 °C	1250 psi @Temperature 70.0 °F	Flatwise Tensile
Shear Strength	29.6 MPa @Temperature 71.1 °C	4300 psi @Temperature 160 °F	Lap Shear
	38.0 MPa @Temperature 21.1 °C	5510 psi @Temperature 70.0 °F	Lap Shear
Peel Strength	9.64 kN/m @Temperature 21.1 °C	55.0 pli @Temperature 70.0 °F	Bell Peel

Processing Properties	Metric	English	Comments
Shelf Life	12.0 Month @Temperature -17.8 °C	12.0 Month @Temperature 0.000 °F

Descriptive Properties	Value	Comments
Areal Weight (psf)	0.06
Climbing Drum Peel (in-lb/3in)	57	70°F
Roll Width (in)	21
Standard Roll (ft2)	645

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