Hexcel® Redux® 312 Modified epoxy film adhesive (0.015 psf)

Category	Polymer , Adhesive , Film , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer	Hexcel
Trade Name
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Hexcel® Redux® 312 Modified epoxy film adhesive (0.015 psf).pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Redux® 312 is a high-strength 250°F curing film adhesive, suitable for metal to metal bonding and sandwich constructions, where operating temperatures of up to 210°F may be experienced. A supported version, Redux® 312/5, is available with a woven nylon carrier for bond line thickness control.Features: Short cure cycle - cures in 30 minutes at 250°F; Good mechanical performance up to 210°F; Suitable for composite to composite bonding; Low volatile content (solventless process).Applications: Metal to metal bonding; Sandwich constructions; Composite to composite bonding.

Mechanical Properties	Metric	English	Comments
Shear Strength	31.7 MPa @Temperature 79.4 °C	4600 psi @Temperature 175 °F	Lap Shear
	33.1 MPa @Temperature 71.1 °C	4800 psi @Temperature 160 °F	Lap Shear
	37.2 MPa @Temperature 21.1 °C	5400 psi @Temperature 70.0 °F	Lap Shear

Processing Properties	Metric	English	Comments
Shelf Life	12.0 Month @Temperature -17.8 °C	12.0 Month @Temperature 0.000 °F

Descriptive Properties	Value	Comments
Areal Weight (psf)	0.015
Roll Width (in)	21
Standard Roll (ft2)	645

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