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Esstech X-970-0000 Ethoxylated Bis Phenol A Dimethacrylate, C29H36O7

Category Polymer , Thermoset , Epoxy , Epoxy Cure Resin
Manufacturer Esstech
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Esstech X-970-0000 Ethoxylated Bis Phenol A Dimethacrylate, C29H36O7.pdf
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Material Notes:
This form of EBPADMA has 2 to 4 units of ethoxylation and is sometimes referred to bis-EMA. It is often used in blends with triethyleneglycol dimethacrylate and bisGMA. This material has low levels of water sorption and a high polymerization rate. X-970-0000 has also been used in anaerobic adhesive applications. Listed on the Toxic Substance Control Act List. CAS # 41637-38-1.Information provided by ESSTECH, Inc.
Physical Properties Metric English Comments
Specific Gravity 1.121 g/cc
1.121 g/cc
Viscosity 775 cP

@Temperature 25.0 °C
775 cP

@Temperature 77.0 °F
Molecular Weight 496.582 g/mol
496.582 g/mol
Optical Properties Metric English Comments
Refractive Index 1.535
1.535
Processing Properties Metric English Comments
Moisture Content <= 0.10 %
<= 0.10 %
Descriptive Properties Value Comments
Acidity (% Methacrylic Acid) < 0.02
MeHQ Inhibitor (ppm) 250-450
Purity (%) > 87
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