Category | Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive |
Manufacturer | Devcon |
Trade Name | |
Port | Shanghai port,China |
Trade Terms | FOB, CFR, CIF |
Payment Terms | L/C, T/T, Western Union |
Download PDF | Devcon Underwater Repair Putty (UW) Epoxy.pdf |
Price | EMAIL US sales@lookpolymers.com |
Physical Properties | Metric | English | Comments |
---|---|---|---|
Density | 1.63 g/cc | 0.0588 lb/in³ |
Mechanical Properties | Metric | English | Comments |
---|---|---|---|
Hardness, Shore D | 82 | 82 | ASTM D2240 |
Tensile Strength, Ultimate | 19.0 MPa | 2760 psi | ASTM D638 |
Modulus of Elasticity | 5.17 GPa | 750 ksi | In Tension; ASTM D638 |
Flexural Yield Strength | 34.4 MPa | 4990 psi | ASTM D790 |
Compressive Yield Strength | 38.78 MPa | 5625 psi | ASTM D695 |
Adhesive Bond Strength | 18.51 MPa | 2685 psi | Adhesive tensile shear strength; ASTM D1002 |
Thermal Properties | Metric | English | Comments |
---|---|---|---|
CTE, linear | 32.0 µm/m-°C @Temperature 20.0 °C |
17.8 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
Thermal Conductivity | 0.590 W/m-K | 4.09 BTU-in/hr-ft²-°F | ASTM C177 |
Maximum Service Temperature, Air | 93.3 °C | 200 °F | Operating Temperature |
Shrinkage | 0.20 % | 0.20 % | During Cure; ASTM D2566 |
Electrical Properties | Metric | English | Comments |
---|---|---|---|
Dielectric Constant | 8.6 | 8.6 | ASTM D150 |
Dielectric Strength | 5.91 kV/mm | 150 kV/in | ASTM D149 |
Processing Properties | Metric | English | Comments |
---|---|---|---|
Processing Temperature | >= 4.44 °C | >= 40.0 °F | |
Pot Life | 45.0 min @Temperature 23.9 °C |
45.0 min @Temperature 75.0 °F |
Descriptive Properties | Value | Comments |
---|---|---|
Coverage per lb. | 68 in² | at 1/4 inch thick |
Mix Ratio by Volume | 1 to 1 | resin:hardener |
Mix Ratio By Weight | 1.4 to 1 | resin:hardener |