Category | Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive |
Manufacturer | Devcon |
Trade Name | Magic Bond™ |
Port | Ningbo port,China |
Trade Terms | FOB, CFR, CIF |
Payment Terms | L/C, T/T, Western Union |
Download PDF | Devcon Magic Bond™ Epoxy Putty.pdf |
Price | EMAIL US sales@lookpolymers.com |
Physical Properties | Metric | English | Comments |
---|---|---|---|
Density | 1.81 g/cc | 0.0654 lb/in³ |
Mechanical Properties | Metric | English | Comments |
---|---|---|---|
Hardness, Shore D | 75 | 75 | ASTM D2240 |
Tensile Strength, Ultimate | 16.9 MPa | 2450 psi | ASTM D638 |
Modulus of Elasticity | 4.83 GPa | 700 ksi | In Tension; ASTM D638 |
Flexural Yield Strength | 29.5 MPa | 4280 psi | ASTM D790 |
Compressive Yield Strength | 82.7 MPa | 12000 psi | ASTM D695 |
Adhesive Bond Strength | 4.83 MPa | 700 psi | Adhesive tensile shear strength; ASTM D1002 |
Thermal Properties | Metric | English | Comments |
---|---|---|---|
CTE, linear | 38.0 µm/m-°C @Temperature 20.0 °C |
21.1 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
Thermal Conductivity | 0.519 W/m-K | 3.59 BTU-in/hr-ft²-°F | ASTM C177 |
Maximum Service Temperature, Air | 121 °C | 250 °F | Operating Temperature |
Shrinkage | 0.30 % | 0.30 % | During Cure; ASTM D2566 |
Electrical Properties | Metric | English | Comments |
---|---|---|---|
Dielectric Constant | 28.1 | 28.1 | ASTM D150 |
Dielectric Strength | 11.8 kV/mm | 300 kV/in | ASTM D149 |
Processing Properties | Metric | English | Comments |
---|---|---|---|
Processing Temperature | 21.1 °C | 70.0 °F | |
Pot Life | 20.0 min @Temperature 23.9 °C |
20.0 min @Temperature 75.0 °F |
Descriptive Properties | Value | Comments |
---|---|---|
Coverage per lb. | 61 in² | at 1/4 inch thick |