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Devcon Magic Bond™ Epoxy Putty

Category	Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer	Devcon
Trade Name	Magic Bond™
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Devcon Magic Bond™ Epoxy Putty.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Emergency Repair ProductsComments: Two-part epoxy putty stick seals leaks and repairs gouges in steel, aluminum, wood, fiberglass, concrete and ceramics. Cures rock-hard and can be painted, sanded, machined, tapped or drilled when fully cured. Waterproof formula cures well under water and remains sealed long-term. Mixes quickly, hardens in 30-40 minutes. For plumbing repairs and marine use.Data provided by Ellsworth Adhesives.

Physical Properties	Metric	English	Comments
Density	1.81 g/cc	0.0654 lb/in³

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	75	75	ASTM D2240
Tensile Strength, Ultimate	16.9 MPa	2450 psi	ASTM D638
Modulus of Elasticity	4.83 GPa	700 ksi	In Tension; ASTM D638
Flexural Yield Strength	29.5 MPa	4280 psi	ASTM D790
Compressive Yield Strength	82.7 MPa	12000 psi	ASTM D695
Adhesive Bond Strength	4.83 MPa	700 psi	Adhesive tensile shear strength; ASTM D1002

Thermal Properties	Metric	English	Comments
CTE, linear	38.0 µm/m-°C @Temperature 20.0 °C	21.1 µin/in-°F @Temperature 68.0 °F	ASTM D696
Thermal Conductivity	0.519 W/m-K	3.59 BTU-in/hr-ft²-°F	ASTM C177
Maximum Service Temperature, Air	121 °C	250 °F	Operating Temperature
Shrinkage	0.30 %	0.30 %	During Cure; ASTM D2566

Electrical Properties	Metric	English	Comments
Dielectric Constant	28.1	28.1	ASTM D150
Dielectric Strength	11.8 kV/mm	300 kV/in	ASTM D149

Processing Properties	Metric	English	Comments
Processing Temperature	21.1 °C	70.0 °F
Pot Life	20.0 min @Temperature 23.9 °C	20.0 min @Temperature 75.0 °F

Descriptive Properties	Value	Comments
Coverage per lb.	61 in²	at 1/4 inch thick

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