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Cotronics Resbond™ 906 High Temperature Ceramic Adhesive, High Expansion
| Category | Ceramic |
| Manufacturer | Cotronics |
| Trade Name | |
| Port | Shanghai port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Cotronics Resbond™ 906 High Temperature Ceramic Adhesive, High Expansion.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Flexural Strength | 10.3 MPa | 1500 psi | |
| Compressive Strength | 20.7 MPa | 3000 psi |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 12.6 µm/m-°C @Temperature 20.0 °C |
7.00 µin/in-°F @Temperature 68.0 °F |
|
| Thermal Conductivity | 5.76 W/m-K | 40.0 BTU-in/hr-ft²-°F | |
| Maximum Service Temperature, Air | 1650 °C | 3000 °F |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Volume Resistivity | 1.00e+9 ohm-cm | 1.00e+9 ohm-cm | |
| Dielectric Strength | 9.84 kV/mm | 250 kV/in |
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