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Cotronics Resbond™ 905 High Temperature Ceramic Adhesive, Low Expansion
| Category | Ceramic |
| Manufacturer | Cotronics |
| Trade Name | |
| Port | Ningbo port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Cotronics Resbond™ 905 High Temperature Ceramic Adhesive, Low Expansion.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Flexural Strength | 14.5 MPa | 2100 psi | |
| Compressive Strength | 22.1 MPa | 3200 psi |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 0.540 µm/m-°C @Temperature 20.0 °C |
0.300 µin/in-°F @Temperature 68.0 °F |
|
| Thermal Conductivity | 1.44 W/m-K | 10.0 BTU-in/hr-ft²-°F | |
| Maximum Service Temperature, Air | 1370 °C | 2500 °F |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Volume Resistivity | 1.00e+11 ohm-cm | 1.00e+11 ohm-cm | |
| Dielectric Strength | 7.87 kV/mm | 200 kV/in |
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