Arlon 85NT Polyimide Nonwoven Aramid Laminate and Prepreg

85NT is a pure polyimide laminate and prepreg system (Tg = 250°C), reinforced with a non-woven aramid substrate. This system combines the high-reliability features of polyimide (improved PTH reliability and temperature stability) with the low in-plane () expansion and outstanding dimensional stability of a non-woven aramid reinforcement.Low in-plane expansion of 6-9 ppm/°C allows attachment of SMT devices with minimal risk of solder failure joint failure due to CTE mismatchNonwoven aramid reinforcement provides outstanding dimensional stability and enhanced registration for improved multilayer yieldsHigh Decomposition temperature offering outstanding high-temperature lifetime performancePolymeric reinforcement results in PCBs typically 25% lighter in weight than conventional glass-reinforced laminatesLaser and plasma ablatable for high speed formations of microvias and other features as small as 25 micronsElectrical and mechanical properties meeting the requirements of IPC-4101/53Compatible with lead-free solderingRoHS/WEEE compliantTypical Applications:Military and commercial avionics, missiles and missile defense, satellites, and other high-reliability SMT applications requiring both low in-plane () CTE valuesPCBs that are subjected to high temperatures during processing, such as lead-free solderingApplications with significant lifetimes at elevated temperatures, such as aircraft engine instrumentations, on-engine applications, or industrial sensorsThis data represents typical values for the production material and should not be used as material specifications.Information provided by ARLON Silicone Technologies Division.