Electrical Properties | Metric | English | Comments |
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Volume Resistivity | <= 0.040 ohm-cm | <= 0.040 ohm-cm | |
Parker Chomerics Tecknit® 0192/0193 Conductive Silicone Sealant/Adhesive Comments: Rec. bond line thickness: < 0.4 mm; flexible past.Typical Applications: Bonding Ag/Cu elastomer gaskets; thin bond gap.Information provided by Chomerics |
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Volume Resistivity | <= 0.040 ohm-cm @Temperature 25.0 °C |
<= 0.040 ohm-cm @Temperature 77.0 °F |
50% RH; Cured; QA-1038 |
Parker Chomerics Tecknit TeckBond™-C Silver-Plated Copper-Filled Adhesive Description: TECKBOND-C is a silicone rubber base filled with silver-plated copper particles to produce a highly conductive one-component adhesive sealant. The system is an RTV moisture-cured compou.. |
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Volume Resistivity | 0.040 ohm-cm | 0.040 ohm-cm | |
Shinil Chemical SHINCON PA66 Electro Conductive Polymer SHINCON is the product line of SHINIL's electrically conductive compound which is able to dissipate the electrostatic charge (ESD) effectively. Shinil has developed SHINCON products using Shinil's .. |
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Volume Resistivity | 0.040 ohm-cm | 0.040 ohm-cm | Aged; Chomerics MAT-1002 |
Parker Chomerics CHO-FORM 5541 Conductive Form-In-Place Gaskets Description: A range of conductive particle technologies combined with thermoset and RTV silicone systems provide a material selection for most opportunities. Multiple filler grades balance material.. |