Processing Properties | Metric | English | Comments |
---|---|---|---|
Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
Hexion Bakelite™ PF 13 Phenolic Formaldehyde Resin, UL Listed
(discontinued **) Phenolic molding compound, inorganically mica filled, heat resistance, good electrical properties, UL listed molding compound 0.75 mm/V-1 (NC), 3 mm/V-0, standardized molding compound.Application ar.. |
|||
Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
Hexion Bakelite™ PF 31 Phenolic Formaldehyde Resin, UL Listed
(discontinued **) Phenolic molding compound, mainly organically filled, standard molding compound for normal stress, UL listed molding compound 1.5 mm/V-1 (All), 3 mm/V-0 (All), standardized molding compound.Applicat.. |
|||
Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
Hexion Bakelite™ PF 31.5 Phenolic Formaldehyde Resin, Improved Electrical Properties
(discontinued **) Phenolic molding compound, mainly organically filled, electrically high grade, standardized molding compound.Application areas: Parts for electrical and telecommunications technology, car electronic.. |
|||
Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
Hexion Bakelite™ PF 31.9 Phenolic Formaldehyde Resin, Ammonia Free
(discontinued **) Phenolic molding compound, mainly organically filled, ammonia free, standardized molding compound.Application areas: Parts for electrical and telecommunications technology, motor vehicle ignition sy.. |
|||
Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
Hexion Bakelite™ PF 51 Phenolic Formaldehyde Resin, Special Preparation Cylindrical Pellets
(discontinued **) Phenolic molding compound, organically filled, reinforced with cotton fibers, increased notched impact strength, standardized molding compound.Application areas: Contact support power switch, switch.. |
|||
Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
Hexion Bakelite™ PF 85 Phenolic Formaldehyde Resin, UL Listed
(discontinued **) Phenolic molding compound, organically filled, reinforced with cotton fibers, average notched impact strength, UL listed molding compound 1.5 mm/HB (BK, BN).Application areas: Switch covers, rolls, .. |
|||
Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
Hexion Bakelite™ PF 1107 Phenolic Formaldehyde Resin, Low Shrinkage, Resistant to High Temperatures
(disconti Phenolic molding compound, inorganically filled, glass fiber reinforced, high heat resistance, low heat expansion coefficient, highest resistance to pressure, high dimensional stability.Application .. |
|||
Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
Hexion Bakelite™ PF 2400 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof, UL Listed
(disc Phenolic molding compound, inorganically/organically filled, average heat resistance, increased dimensional stability, dish washer proof, UL listed molding compound 1.5 mm/V-0 (ALL).Application area.. |
|||
Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
Hexion Bakelite™ PF 2535 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof
(discontinued ** Phenolic molding compound, inorganically/organically filled, average heat resistant, steam resistant, dish washer proof, high surface quality.Application areas: Fittings for ovens and dishwashers, t.. |
|||
Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
Hexion Bakelite™ PF 4109 Phenolic Formaldehyde Resin, Improved Electrical Properties, Ammonia Free, Resistant to High Temperatures, Low Shrinkage, High Arc Resistance, UL Listed, Acetic Acid Free Phenolic molding compound, inorganically filled, glass fiber reinforced, ammonia and acetic acid free, electrically high grade, high temperature stability, low shrinkage, high mechanical strength, U.. |
|||
Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
Hexion Bakelite™ PF 6507 Phenolic Formaldehyde Resin, Elasticized, Low Shrinkage, Resistant to High Temperatures, High Mechanical Strength Phenolic molding compound, inorganically filled, glass fiber reinforced, elastomer modified, galvanizable, heat resistant, good media resistance, high dimensional stability at raised temperature, hi.. |
|||
Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
Hexion Bakelite™ PF 7400 Phenolic Formaldehyde Resin, High Mechanical Strength
(discontinued **) Phenolic molding compound, organically filled, reinforced with cotton fiber flakes, high notched impact strength.Application areas: Moldings for higher mechanical strain, e.g. power plugs high volta.. |
|||
Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
Hexion Bakelite™ PF 7592 Phenolic Formaldehyde Resin, Galvanized, Conductive
(discontinued **) Phenolic molding compound, inorganically/organically filled. Shrinkage fies compatible to values of UP 3310 and PF 2560. Electroplateable.Application areas: Chromium plated oven strips.Information.. |
|||
Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
Hexion Bakelite™ PF 12404 Phenolic Formaldehyde Resin, High Surface Quality, Low Shrinkage
(discontinued **)& Phenolic molding compound, inorganically/organically filled, good dimensional stability, low shrinkage.Application areas: Housing parts for gas meter.Information provided by Bak AGBak AG became a pa.. |
|||
Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
Hexion Bakelite™ PF 13591 Phenolic Formaldehyde Resin, High Surface Quality, UL Listed
(discontinued **) Phenolic molding compound, mainly organically filled, very soft flow for large molds, UL listed molding compound 1.5 mm/V-1 (BK), 3.0 mm/V-0 (BK).Application areas: Pan handles, various applications.. |
|||
Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
Hexion Bakelite™ PF 14600 Phenolic Formaldehyde Resin, High Surface Quality
(discontinued **) Phenolic molding compound, mainly organically filled, low specific gravity.Application areas: Cookware fittings, electric devices.Information provided by Bak AGBak AG became a part of Hexion in 2005.. |
|||
Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
Hexion Bakelite™ PF 38110 Phenolic Formaldehyde Resin, High Surface Quality
(discontinued **) Phenolic molding compound, mainly organically filled.Application areas: Devices for the electrical installation, pan handles, knobs, mainly for compression molding.Information provided by Bak AGBak .. |
|||
Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
Hexion Bakelite™ 151733 Phenolic Formaldehyde Resin
(discontinued **) Phenolic molding compound, mainly organically filled, standard molding compound for normal stress.Application areas: Contact strips.Information provided by Bak AGBak AG became a part of Hexion in 20.. |
|||
Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
Hexion Bakelite™ 460124 Phenolic Formaldehyde Resin
(discontinued **) Phenolic molding compound, mainly organically filled, standard molding compound for normal stress.Application areas: Cookware fittings, electric devices.Information provided by Bak AGBak AG became a.. |
|||
Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
Hexion Bakelite™ X24 Phenolic Formaldehyde Resin
(discontinued **) Phenolic molding compound, mainly organically filled.Application areas: Operating controls, housing parts, lamp holders.Information provided by Bak AGBak AG became a part of Hexion in 2005. |
|||
Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
Hexion Bakelite™ X65 Phenolic Formaldehyde Resin, UL Listed
(discontinued **) Phenolic molding compound, inorganically/organically filled, good heat-resistance and dimensional stability, UL listed molding compound 3.0 mm/V-0 (BN, BK).Application areas: Oven strips.Information.. |
|||
Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
Hexion Bakelite™ PF 6501 Phenolic Formaldehyde Resin, Low Shrinkage Phenolic molding compound, inorganically filled, glass fiber reinforced, high dimensional stability at raised temperature, good media resistance, heat-resistant.Application areas: Thermally and dyna.. |
|||
Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
Hexion Bakelite™ PF 4010 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage
(disconti Glass fiber reinforced and inorganically filled molding compound. High heat resistance, reduced molding shrinkage, good chemical resistance and mechanical properties.Application areas: Switch housi.. |
|||
Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
Hexion Bakelite™ PF 4111 Phenolic Formaldehyde Resin, Improved Electrical Properties, Ammonia Free, Resistant to High Temperatures, Low Shrinkage, High Arc Resistance, UL Listed, Acetic Acid Free, Copper Adhesive Phenolic molding compound, inorganically filled, glass fiber reinforced, ammonia and acetic acid free, electrically high grade, high temperature stability, high mechanical strength, copper-adhesive,.. |
|||
Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
Hexion Bakelite™ PF 7595 Phenolic Formaldehyde Resin, Low Coefficient of Friction, Galvanized, Conductive
(di Phenolic molding compound, inorganically/organically filled, modified with graphite, good heat conductivity, good sliding properties, conductive in electrical properties.Application areas: Bearers f.. |
|||
Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
Hexion Bakelite™ PF 8052 Phenolic Formaldehyde Resin, Resistant to High Temperatures
(discontinued **) Phenolic molding compound, glass fiber reinforced and inorganically filled. Excellent heat resistance with respect to surface finish and mechanical properties.Application areas: Pan handles, heat r.. |
|||
Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
Hexion Bakelite™ PF 83 Phenolic Formaldehyde Resin, Special Preparation Cylindrical Pellets
(discontinued **) Phenolic molding compound, organically filled, reinforced with cotton fibers, increased notched impact strength, standardized molding compound.Application areas: Switch covers, rolls, handle casings.. |
|||
Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
Hexion Bakelite™ PF 2560 Phenolic Formaldehyde Resin, High Surface Quality, For Electrostatic Coating, UL Listed
&n Phenolic molding compound, inorganically/organically filled, average heat resistant, high surface quality, lower water absorption than PF 31, minimal distortion, UL listed molding compound 1.5 mm/V-.. |
|||
Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
Hexion Bakelite™ PF 2836 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage, UL Listed
&nbs Phenolic molding compound, inorganically/organically filled, increased heat resistance, increased tracking resistance, low shrinkage and post shrinkage, improved electrical properties, UL listed mol.. |
|||
Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding |
Hexion Bakelite™ PF 4155 Phenolic Formaldehyde Resin, Resistant to High Temperatures, Improved Electrical Properties, Low Shrinkage, High Mechanical Strength Phenolic molding compound, inorganically filled, glass fiber reinforced, good media and temperature resistance. Conditioned Cu-adhesion.Application areas: Commutators (fuel pumps, actuators, starte.. |