Processing Properties | Metric | English | Comments |
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Pot Life | 60 - 90 min | 60 - 90 min | Mass: 50g; TM R050-19 |
Resinlab® EP1121 Clear Electronic Grade Epoxy Encapsulant Resinlab™ EP1121 Clear is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures completely at room temperature to a tough, flexible polymer. I.. |
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Pot Life | >= 60 min | >= 60 min | |
Parker Chomerics CHO-BOND 584-208 Conductive Adhesive Two-component, highly conductive adhesive system that combines the good adhesive characteristics of epoxy with the superior conductivity of silver. In addition to being available in bulk form, the m.. |
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Pot Life | 60 - 90 min | 60 - 90 min | Mass: 150g; TM R050-19 |
Resinlab® EP1295 Black Medium Viscosity, Halogen Free, Flame Retardant Epoxy Casting Resin Resinlab™ EP1295 Black is a medium viscosity, halogen free, flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Laboratories Inc., (.. |
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Pot Life | 60 - 120 min | 60 - 120 min | Mass: 100g |
Resinlab® EP324E Clear Two Part Epoxy Casting Resin Resinlab™ EP 324E Clear is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wettin.. |
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Pot Life | 60 min | 60 min | |
Huntsman Euredur 450 Cycloaliphatic Amine Approx. H+ equivalent weight 115. Mix Ratio with GY 6010 is 60.Comments/Applications: For high-humid application areas and underwater applications. To be used in surface tolerant coatings systems.. |
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Pot Life | 60 - 120 min | 60 - 120 min | Time before parts must be mated |
Lord Adhesives 304 General Purpose, High Viscosity Epoxy Adhesive Lord Epoxy AdhesivesLord® Epoxy Adhesives create superior bonds for rubber, SMC, plastics and metals. Our epoxy adhesives are widely used in the automotive industry, over 10 million cars and ligh.. |
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Pot Life | 60 min | 60 min | |
Henkel Hysol EA 9377 Paste Adhesive System Moldable plastic shim, excellent microcracking resistance under thermal cycling. High compressive strength.Application: Liquid Shim |
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Pot Life | 60 - 85 min | 60 - 85 min | 200 gram mass |
Master Bond EP21LV35Med Two Component, Flexible USP Class VI Epoxy System Master Bond Polymer System EP21LV3/5Med is a two part, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulation and casting that cures flexible. It cures readil.. |
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Pot Life | 60 - 90 min | 60 - 90 min | 100 gram mass |
Master Bond EP21LV-LO Two Component, Lower Viscosity, Room Temperature Curing Epoxy System Product Description: Master Bond EP21LV-LO is a two component, lower viscosity, room temperature curing epoxy system for high performance bonding, sealing, coating and encapsulation. This user frien.. |
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Pot Life | >= 60 min | >= 60 min | 100 gram mass |
Master Bond EP21TDC-2ND Two component, highly flexibilized, non-drip epoxy resin compound Product Description: Master Bond EP21TDC-2ND is a two component highly flexible epoxy resin system for high performance bonding, sealing and coating with a non-drip consistency. It has a forgiving o.. |
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Pot Life | 60 - 75 min | 60 - 75 min | 200 gram mass |
Master Bond EP21TDCN Two Component Nickel Conductive Epoxy Adhesive Product Description: Master Bond Polymer System EP21TDCN is a two component, nickel filled, electrically conductive, adhesive for high performance bonding, formulated to cure at room temperature or .. |
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Pot Life | 60 min | 60 min | |
Tra-Con Tra-Bond 2135D High Impact Epoxy Adhesive TRA-BOND 2135D is a medium viscosity epoxy adhesive recommended for bonding, laminating, sealing, and structural repair applications where easy mixing and good wetting combined with high impact stre.. |
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Pot Life | 60 min | 60 min | |
Tra-Con Tra-Bond Ablebond 724-1 Polyurethane Adhesive Ablebond 724-1 premixed and frozen, polyurethane adhesive is designed for good adhesion, providing strong resilient bonds to a wide variety of substrates.Information provided by Tra-Con Inc. |
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Pot Life | 60 min | 60 min | |
Tra-Con Tra-Duct 2902 Room Temperature Conductive Silver Epoxy Adhesive TRA-DUCT 2902 is an electrically conducting silver-filled epoxy compound recommended for electronic bonding and sealing applications that require a combination of good mechanical and electrical prop.. |
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Pot Life | 60 min | 60 min | |
Epoxy Technology EPO-TEK® 305 Spectrally Transparent Epoxy Product Description: EPO-TEK® 305 is a two component, semi-rigid, optical grade epoxy for semiconductor packaging of fiber optics, optoelectronics and medical devices. It is an electrically and th.. |
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Pot Life | 60 min | 60 min | |
Epoxyset Epoxibond EB-106 Unfilled Epoxy Adhesive A two-component, unfilled epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries.Information provided by Epoxyset Inc. |
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Pot Life | 60 min | 60 min | |
Epoxyset Epoxibond EB-135 Unfilled Epoxy Adhesive A two-component, unfilled epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries. EB-135 has excellent bond strength to various substrat.. |
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Pot Life | 60 - 90 min | 60 - 90 min | Working life |
Abatron MasterMold 12-8 Flexible Mold Making Compound Master mold 12-8 is a pourable version of MasterMold 12-3 for creating a mold by pouring it into, or around, the model.Processing: Part A Resin: Clear, pourable viscous liquid, 8.7 lbs/galPart B Con.. |
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Pot Life | 60 - 120 min | 60 - 120 min | |
Aremco Ceramacast™ 645-N High Temperature Potting & Casting Material Silica Castable ceramic with low thermal conductivity. |
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Pot Life | 60 - 120 min | 60 - 120 min | |
Aremco Ceramacast™ 675-N High Temperature Potting & Casting Material Aluminum Nitride Fine grain aluminum nitride castable with high thermal conductivity. |
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Pot Life | 60 - 90 min | 60 - 90 min | Working life |
Abatron MasterMold 12-3 Flexible Mold Making Compound Master mold 12-3 is formulated for versatility, high elasticity and strength. It is a 2-component polyurethane system and can be easily spread on any model to produce a smooth bubble-free mold surf.. |
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Pot Life | 60 min @Temperature 24.0 °C |
60 min @Temperature 75.2 °F |
1 lb. mass |
BCC Products BC 5114 Epoxy Laminating System BC 5114 is a gray low viscosity laminating system. This heat resistant resin exhibits excellent wet out, reasonable working time and may be used at room temperature without post-curing. For use abov.. |
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Pot Life | 60 - 90 min | 60 - 90 min | Mass: 100g; TM R050-19 |
Resinlab® EP1296 Highly Filled, Moderately Thixotropic Black Casting Resin Resinlab™ EP1296 is a highly filled, moderately thixotropic black casting resin designed for applications requiring good thermal conductivity, low shrinkage and a low CTE. It was especially formula.. |
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Pot Life | 60 min | 60 min | Mass: 5g; TM R050-19 |
Resinlab® SEC1233 Silver Filled Epoxy Adhesive Resinlab™ SEC1233 is a silver filled, two component, room temperature curing epoxy adhesive. It is designed to cure completely at room temperature. SEC1233 provides excellent electrical conductivit.. |
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Pot Life | 60 - 90 min | 60 - 90 min | Mass: 50g; TM R050-19 |
Resinlab® EP1121 Black Electronic Grade Epoxy Encapsulant Resinlab™ EP1121 Black is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures completely at room temperature to a tough, flexible polymer. I.. |