Thermal Properties | Metric | English | Comments |
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Thermal Conductivity | 0.133 W/m-K | 0.923 BTU-in/hr-ft²-°F | Melt |
Covestro Desmopan® 9385 Polyurethane Extrusion- and injection molding gradevery good hydrolysis and microbial resistancegood low-temperature flexibilitycomplies with VDE 0282-10ApplicationCable sheathingsHosesnon-reinforcedPreprocessin.. |
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Thermal Conductivity | 0.133 W/m-K | 0.923 BTU-in/hr-ft²-°F | Melt |
Covestro Desmopan® DP 9392AU Polyurethane Extrusion- and injection molding gradewith special UV stabilizersvery good hydrolysis and microbial resistancegood low-temperature flexibilityApplicationHosesnon-reinforcedCable sheathingsProfilesTe.. |
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Thermal Conductivity | 0.133 W/m-K | 0.923 BTU-in/hr-ft²-°F | Melt |
Covestro Desmopan® DP 9650DU Polyurethane Extrusion- and injection molding gradewith special UV stabilizerstransparent up to 6 mm wall thicknessvery good hydrolysis and microbial resistanceApplicationSki boot shellsHosesnon-reinforcedAs of .. |
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Thermal Conductivity | 0.133 W/m-K @Thickness 6.35 mm, Temperature 44.3 °C |
0.923 BTU-in/hr-ft²-°F @Thickness 0.250 in, Temperature 112 °F |
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3M Scotch-Weld™ DP100 Plus Clear Epoxy Adhesive 3M™ Scotch-Weld™ Epoxy Adhesive DP100 Plus Clear is a fast setting, two-part, 1:1 mix ratio mercaptan-cured epoxy adhesive. It is a unique among fast setting mercaptan cure epoxies in that it comb.. |