Thermal Properties | Metric | English | Comments |
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Thermal Conductivity | 1.15 W/m-K | 7.98 BTU-in/hr-ft²-°F | |
Mykroy/Mycalex MM 500 Machining Grade Glass-bonded Mica Composite Synthetic mica filler. Does not burn. Better radiation resistance (3 x 10^10 Rads-Cobalt) than grade 400.This ceramoplastic material is a versatile and efficient insulating material designed to me.. |
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Thermal Conductivity | 1.15 - 1.30 W/m-K | 8.00 - 9.00 BTU-in/hr-ft²-°F | |
Master Bond EP76M-F Electrically Conductive, Two Part Epoxy Description: Master Bond EP76M-F is a two component, nickel filled, electrically conductive epoxy system for high performance bonding, sealing, and coating formulated to cure at room temperature or .. |
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Thermal Conductivity | 1.15 - 1.30 W/m-K | 8.00 - 9.00 BTU-in/hr-ft²-°F | |
Master Bond MasterSil 156 Two Part, Low Viscosity Silicone Description: Master Bond MasterSil 156 is a two component, lower viscosity silicone system for high performance potting, encapsulation and sealing. MasterSil 156 combines high temperature resistance.. |
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Thermal Conductivity | 1.15 W/m-K | 7.98 BTU-in/hr-ft²-°F | |
Trelleborg Emerson & Cuming Stycast® 5954 Two-Component Silicone High Service Temp Encapsulant Features and Typical ApplicationsAbility to withstand high temperatures, thermal shock, and chemical exposure. These products are designed for heat generating electronic devices which operate in har.. |
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Thermal Conductivity | 1.15 W/m-K | 8.00 BTU-in/hr-ft²-°F | |
Cotronics Resbond™ 918 High Temperature Ceramic Adhesive, One Composition |
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Thermal Conductivity | 1.15 W/m-K | 8.00 BTU-in/hr-ft²-°F | |
Cotronics Resbond™ 940 High Temperature Ceramic Adhesive, Fast Set |
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Thermal Conductivity | 1.15 W/m-K | 8.00 BTU-in/hr-ft²-°F | |
Cotronics 4420 One-Part Epoxy |
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Thermal Conductivity | 1.15 W/m-K | 7.98 BTU-in/hr-ft²-°F | |
Resinlab® EP1285HD-10 Highly Filled, Medium Viscosity Casting Resin Resinlab™ EP1285 (Formerly Lab Product W021901 series) is a highly filled, medium viscosity black casting resin designed for applications requiring a high degree of thermal conductivity and a low C.. |