Thermal Properties | Metric | English | Comments |
---|---|---|---|
Thermal Conductivity | 0.530 W/m-K | 3.68 BTU-in/hr-ft²-°F | ASTM C177 |
PolyOne Edgetek® NN-50GF/000EM L Polyamide 66 (Nylon 66) Information provided by PolyOne |
|||
Thermal Conductivity | 0.530 W/m-K | 3.68 BTU-in/hr-ft²-°F | ASTM C177 |
Solvay Specialty Polymers Torlon® 4301 Polyamide-imide (PAI)
(Unverified Data**) Torlon 4301 is a wear-resistant grade of polyamide-imide (PAI) resin. It has a good balance of mechanical properties and wear resistance. It offers high flexural and compressive strength with a low .. |
|||
Thermal Conductivity | 0.530 W/m-K | 3.68 BTU-in/hr-ft²-°F | |
Chevron Phillips Xtel® XK2760BL Polyphenylene Sulfide Alloy
(discontinued **) Xtel® XK2760BL is a high performance, glass fiber and mineral filled PPS based alloy developed to provide excellent mechanical strength with a unique blend of toughness, rigidity, and low flash cha.. |
|||
Thermal Conductivity | 0.530 W/m-K | 3.68 BTU-in/hr-ft²-°F | ASTM C177 |
Solvay Specialty Polymers Torlon® 4301 Polyamide-imide (PAI) Torlon® 4301 is a wear-resistant grade of polyamide-imide (PAI) resin. It has a good balance of mechanical properties and wear resistance. It offers high flexural and compressive strength with a .. |
|||
Thermal Conductivity | 0.530 W/m-K @Temperature 100 °C |
3.68 BTU-in/hr-ft²-°F @Temperature 212 °F |
ASTM E1461 |
Plenco 3597 Phenolic, Granular, Injection Molded PLENCO 03597 is a mineral filled phenolic molding compound offering excellent flammability ratings even at thin cross sections, along with excellent arc and comparative track resistance values. UL r.. |
|||
Thermal Conductivity | 0.530 W/m-K @Temperature 40.0 °C |
3.68 BTU-in/hr-ft²-°F @Temperature 104 °F |
ISO 8302 |
Ensinger TECASINT 1021 Polyimide, 15% Graphite Filled (PI) TECASINT is a range of non-melting high temperature polyimides characterized by high strength over a wide range of temperatures, good long term thermal stability, minimal thermal expansion and excel.. |