Thermal Properties | Metric | English | Comments |
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Thermal Conductivity | 0.520 W/m-K @Temperature 80.0 °C |
3.61 BTU-in/hr-ft²-°F @Temperature 176 °F |
ASTM C518 |
Rogers Corporation LoPro™ RO4730 Antenna Grade Non-PTFE Laminate RO4730 LoPro Antenna Grade Laminates are fully compatible with conventional FR-4 and high temperature lead-free solder processing. The resin systems of RO4730 dielectric materials are designed to p.. |
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Thermal Conductivity | 0.520 W/m-K | 3.61 BTU-in/hr-ft²-°F | ASTM C177 |
Solvay Specialty Polymers Torlon® 7130 Polyamide-imide (PAI), 30% Carbon Fiber Torlon® 7130 is an 30% carbon-fiber reinforced grade of polyamide-imide (PAI) resin. It offers high strength and modulus, exceptional creep resistance, and good fatigue resistance. It has thermal.. |
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Thermal Conductivity | 0.520 W/m-K | 3.61 BTU-in/hr-ft²-°F | ASTM F433 |
Sumitomo Bakelite North America RX® 611 Fiberglass Reinforced Phenolic RX 611 is a fiberglass reinforced phenolic molding compound, with good dimensional stability and good strength at elevated temperatures. Meets ASTM D-5948 Type MFH.Information supplied by Sumitomo.. |
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Thermal Conductivity | 0.520 W/m-K | 3.61 BTU-in/hr-ft²-°F | ASTM C177 |
Solvay Specialty Polymers Torlon® 7130 Polyamide-imide (PAI)
(Unverified Data**) Torlon 7130 is an 30% carbon-fiber reinforced grade of polyamide-imide (PAI) resin. It offers high strength and modulus, exceptional creep resistance, and good fatigue resistance. It has thermal exp.. |