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Polymer Property : CTE, linear = 62.0 µm/m-°C Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 62.0 µm/m-°C | 34.4 µin/in-°F | |
| Resinlab® EP1112 Clear Electronic Grade Epoxy Encapsulant Resinlab™ EP 1112 Clear is a two part unfilled fast curing electronic grade epoxy encapsulant designed for small to medium sized castings. It cures completely at room temperature to a tough, flexib.. |
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| CTE, linear | 62.0 - 100 µm/m-°C | 34.4 - 55.6 µin/in-°F | Average value: 74.0 µm/m-°C Grade Count:33 |
| Overview of materials for Polycarbonate/ASA Alloy, Unreinforced This property data is a summary of similar materials in the MatWeb database for the category "Polycarbonate/ASA Alloy, Unreinforced". Each property range of values reported is minimum and maximum va.. |
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| CTE, linear | 62.0 µm/m-°C | 34.4 µin/in-°F | DIN 52328 |
| Isoflon PEI Polyetherimide Materials with strong mechanical and electrical performances under high temperatures.Information provided by Isoflon. |
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| CTE, linear | 62.0 µm/m-°C @Temperature -30.0 - 100 °C |
34.4 µin/in-°F @Temperature -22.0 - 212 °F |
ASTM D696 |
| LyondellBasell Hifaxâ„¢ CB228 Thermoplastic Olefin Resin Key Features: medium melt flow, medium high modulus, paintable thermoplastic elastomeric olefin resin, excellent impact and stiffness balance, good paintability, good processabilityApplications: aut.. |
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| CTE, linear | 62.0 µm/m-°C @Temperature 20.0 °C |
34.4 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
| A. Schulman POLYTROPE™ TPP 524 Injection Molding Grade Olefinic Thermoplastic Elastomer DescriptionPolytrope TPP 524 is an injection molding grade olefinic thermoplastic elastomer. This mineral filled product is recommended for applications requiring high stiffness and low thermal exp.. |
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| CTE, linear | 62.0 µm/m-°C @Temperature 20.0 °C |
34.4 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
| A. Schulman POLYTROPE™ TPP 524 Injection Molding Grade Olefinic Thermoplastic Elastomer DescriptionPolytrope TPP 524 is an injection molding grade olefinic thermoplastic elastomer. This mineral filled product is recommended for applications requiring high stiffness and low thermal exp.. |
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| CTE, linear | 62.0 µm/m-°C | 34.4 µin/in-°F | ASTM D696 |
| Unitika P-1001 Engineering Plastic P series resins are resins succeeding the characteristics of the neat polymer, U100, and improved in flowability and optical properties. Among many super engineering plastics, the resins are few tra.. |
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| CTE, linear | 62.0 µm/m-°C @Temperature 20.0 °C |
34.4 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
| A. Schulman POLYTROPE™ TPP 524 Injection Molding Grade Olefinic Thermoplastic Elastomer DescriptionPolytrope TPP 524 is an injection molding grade olefinic thermoplastic elastomer. This mineral filled product is recommended for applications requiring high stiffness and low thermal exp.. |
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| CTE, linear | 62.0 µm/m-°C @Temperature 20.0 °C |
34.4 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
| A. Schulman POLYTROPE™ TPP 524 Injection Molding Grade Olefinic Thermoplastic Elastomer DescriptionPolytrope TPP 524 is an injection molding grade olefinic thermoplastic elastomer. This mineral filled product is recommended for applications requiring high stiffness and low thermal exp.. |
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| CTE, linear | 62.0 µm/m-°C @Temperature 20.0 °C |
34.4 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
| A. Schulman POLYTROPE™ TPP 524 Injection Molding Grade Olefinic Thermoplastic Elastomer DescriptionPolytrope TPP 524 is an injection molding grade olefinic thermoplastic elastomer. This mineral filled product is recommended for applications requiring high stiffness and low thermal exp.. |
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| CTE, linear | 62.0 µm/m-°C | 34.4 µin/in-°F | Below Tg |
| Tra-Con Tra-Bond F112 Fiber Optic Epoxy Adhesive TRA-BOND F112 is a long pot life, impact resistant, fiber-optic adhesive. This two-part, low viscosity epoxy has the distinct advantage of remaining below 3000 cps for a minimum of 40 minutes. This .. |
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| CTE, linear | 62.0 µm/m-°C @Temperature 20.0 °C |
34.4 µin/in-°F @Temperature 68.0 °F |
|
| Tra-Con Tra-Cast 3012 Clear Epoxy Casting Compound TRA-CAST 3012 is a clear, low viscosity epoxy casting compound recommended for industrial embedding and casting applications where its combination of superior properties good clarity, long pot life,.. |
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| CTE, linear | 62.0 µm/m-°C @Temperature 20.0 °C |
34.4 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
| A. Schulman POLYTROPE™ TPP 524 Injection Molding Grade Olefinic Thermoplastic Elastomer DescriptionPolytrope TPP 524 is an injection molding grade olefinic thermoplastic elastomer. This mineral filled product is recommended for applications requiring high stiffness and low thermal exp.. |
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| CTE, linear | 62.0 µm/m-°C | 34.4 µin/in-°F | ASTM D696 |
| Unitika L-8005 Chemical resistance, and excellent lubricant propertyInformation provided by Unitika Ltd. |
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| CTE, linear | 62.0 µm/m-°C | 34.4 µin/in-°F | ASTM D696 |
| Unitika P-1001A Engineering Plastic P series resins are resins succeeding the characteristics of the neat polymer, U100, and improved in flowability and optical properties. Among many super engineering plastics, the resins are few tra.. |
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| CTE, linear | 62.0 µm/m-°C @Temperature 50.0 - 150 °C |
34.4 µin/in-°F @Temperature 122 - 302 °F |
|
| Dow SiLK™ I 1070 Semiconductor Dielectric Resin SiLK™ I 1070 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 1070 is compatible wi.. |
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| CTE, linear | 62.0 µm/m-°C @Temperature 50.0 - 150 °C |
34.4 µin/in-°F @Temperature 122 - 302 °F |
|
| Dow SiLK™ I 130 Semiconductor Dielectric Resin SiLK™ I 130 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 130 is compatible with.. |
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| CTE, linear | 62.0 µm/m-°C @Temperature 50.0 - 150 °C |
34.4 µin/in-°F @Temperature 122 - 302 °F |
|
| Dow SiLK™ I 1500 Semiconductor Dielectric Resin SiLK™ I 1500 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 1500 is compatible wi.. |
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| CTE, linear | 62.0 µm/m-°C @Temperature 50.0 - 150 °C |
34.4 µin/in-°F @Temperature 122 - 302 °F |
|
| Dow SiLK™ I 360 Semiconductor Dielectric Resin SiLK™ I 360 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 360 is compatible with.. |
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| CTE, linear | 62.0 µm/m-°C @Temperature 50.0 - 150 °C |
34.4 µin/in-°F @Temperature 122 - 302 °F |
|
| Dow SiLK™ I 550 Semiconductor Dielectric Resin SiLK™ I 550 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 550 is compatible with.. |
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| CTE, linear | 62.0 µm/m-°C @Temperature 50.0 - 150 °C |
34.4 µin/in-°F @Temperature 122 - 302 °F |
|
| Dow SiLK™ I 620 Semiconductor Dielectric Resin SiLK™ I 620 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 620 is compatible with.. |
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| CTE, linear | 62.0 µm/m-°C @Temperature 50.0 - 150 °C |
34.4 µin/in-°F @Temperature 122 - 302 °F |
|
| Dow SiLK™ I300 280 Semiconductor Dielectric Resin SiLK™ I300 280 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I300 280 is compatibl.. |
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| CTE, linear | 62.0 µm/m-°C @Temperature 50.0 - 150 °C |
34.4 µin/in-°F @Temperature 122 - 302 °F |
|
| Dow SiLK™ I300 380 Semiconductor Dielectric Resin SiLK™ I300 380 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I300 380 is compatibl.. |
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| CTE, linear | 62.0 µm/m-°C @Temperature 50.0 - 150 °C |
34.4 µin/in-°F @Temperature 122 - 302 °F |
|
| Dow SiLK™ I300 560 Semiconductor Dielectric Resin SiLK™ I300 560 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I300 560 is compatibl.. |
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| CTE, linear | 62.0 µm/m-°C @Temperature 20.0 °C |
34.4 µin/in-°F @Temperature 68.0 °F |
|
| Cotronics Bond-It™ 7040 Epoxy, Room Temperature Cure Forms high strength bonds to difficult metals, plastics, glass, ceramics, composites, etc. Cures at room temperature with high temperature strength and good electrical and thermal shock resistance... |
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| CTE, linear | 62.0 µm/m-°C @Temperature 50.0 - 410 °C |
34.4 µin/in-°F @Temperature 122 - 770 °F |
|
| Dow SiLK™ I 260 Semiconductor Dielectric Resin SiLK™ I 260 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 260 is compatible with.. |
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| CTE, linear | 62.0 µm/m-°C @Temperature 50.0 - 150 °C |
34.4 µin/in-°F @Temperature 122 - 302 °F |
|
| Dow SiLK™ I300 140 Semiconductor Dielectric Resin SiLK™ I300 140 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I300 140 is compatibl.. |
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| CTE, linear | 62.0 µm/m-°C | 34.4 µin/in-°F | |
| Atom Adhesives AA-BOND F113 Epoxy Adhesive AA-BOND F113 is an Optically Clear, low viscosity , High impact epoxy adhesives developed for bonding and small volume potting of plastic or glass optical fibers, lenses and prisms, LED displays, an.. |
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| CTE, linear | 62.0 µm/m-°C | 34.4 µin/in-°F | Below Tg |
| Tra-Con Tra-Bond 872-3 Flexible Epoxy Adhesive TRA-BOND 872-3 transparent, flexible epoxy adhesive is designed for bonding materials with mismatched coefficients of thermal expansion. The long working life of this adhesive makes it ideal for use.. |
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| CTE, linear | 62.0 µm/m-°C | 34.4 µin/in-°F | |
| Resinlab® EP1112 Black Electronic Grade Epoxy Encapsulant Resinlab™ EP 1112 Black is a two part unfilled fast curing electronic grade epoxy encapsulant designed for small to medium sized castings. It cures completely at room temperature to a tough, flexib.. |
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