Thermal Properties | Metric | English | Comments |
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CTE, linear | 55.1 µm/m-°C @Temperature 20.0 °C |
30.6 µin/in-°F @Temperature 68.0 °F |
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Westlake Plastics Imidex Thermoplastic Polyimide Made from Aurum® resin. Applications include electronics, acoustics, composites, wire/cable insulation, adhesive film, and washers/gaskets. It will not melt unto itself, is thermoformable, has hi.. |
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CTE, linear | 55.1 µm/m-°C | 30.6 µin/in-°F | |
Hexcel® HexPly® 954-3 Curing Cyanate Resin HexPly® 954-3 is a 350°F (177°C) curing cyanate resin with excellent resistance to moisture absorption, outgassing and microcracking. HexPly® 954-3 is formulated for autoclave or press molding u.. |
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CTE, linear | 55.1 µm/m-°C | 30.6 µin/in-°F | |
Atom Adhesives AA-BOND 2104 Epoxy Adhesive AA-BOND 2104 is a thixotropic epoxy system recommended for critical electronics, aerospace and industrial bonding, laminating and reinforcing applications requiring an adhesive with high-fill, non-s.. |
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CTE, linear | 55.1 µm/m-°C | 30.6 µin/in-°F | |
Atom Adhesives AA-BOND FDA15 Epoxy Adhesive AA-BOND FDA15 is a low viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Administr.. |
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CTE, linear | 55.1 µm/m-°C | 30.6 µin/in-°F | |
Atom Adhesives AA-BOND 2116 Epoxy Adhesive AA-BOND 2116 is a thixotropic, low vapor pressure epoxy system that passes the NASA Outgassing Specification. It is recommended for critical electronics, aerospace, and industrial applications where.. |