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Polymer Property : CTE, linear = 26.0 µm/m-°C Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 26.0 µm/m-°C @Temperature 25.0 - 150 °C |
14.4 µin/in-°F @Temperature 77.0 - 302 °F |
ASTM TMA |
| PBI Performance Products Celazole® TL-60 Self Lubricating Melt Processable Polybenzimidazole Celazole® polybenzimidazole (PBI) resin is a unique and highly stable linear hetrocyclic polymer. PBI is characterized by high strength; excellent thermal stability, and broad chemical resistance. .. |
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| CTE, linear | 26.0 µm/m-°C @Temperature 25.0 - 150 °C |
14.4 µin/in-°F @Temperature 77.0 - 302 °F |
ASTM TMA |
| PBI Performance Products Celazole® TF-60 C Carbon Fiber Reinforced Melt Processable Polybenzimidazole Celazole® polybenzimidazole (PBI) resin is a unique and highly stable linear hetrocyclic polymer. PBI is characterized by high strength; excellent thermal stability, and broad chemical resistance. .. |
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| CTE, linear | 26.0 - 120 µm/m-°C | 14.4 - 66.7 µin/in-°F | Average value: 85.4 µm/m-°C Grade Count:71 |
| Overview of materials for Polycarbonate/PET Polyester Blend This property data is a summary of similar materials in the MatWeb database for the category "Polycarbonate/PET Polyester Blend". Each property range of values reported is minimum and maximum values.. |
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| CTE, linear | 26.0 µm/m-°C @Temperature 20.0 °C |
14.4 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
| Covestro Petlon® PC/PET 36A 620UV Yellow Semi-Crystalline PET, 10% Glass Fiber
(discontinued **) Characteristics: Good Thermal and Dimensional Stability, Good Chemical ResistanceApplications: Automotive Panels, Electronic Housings, Pump HousingsProcessing: Injection Molding (Melt Temperature: 5.. |
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| CTE, linear | 26.0 µm/m-°C @Temperature 20.0 °C |
14.4 µin/in-°F @Temperature 68.0 °F |
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| Indium Corp. Indalloy 141 Tin-Lead Solder Alloy Information Provided by Indium Corporation |
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| CTE, linear | 26.0 µm/m-°C @Temperature 20.0 °C |
14.4 µin/in-°F @Temperature 68.0 °F |
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| Indium Corp. Indalloy® 10 Pb-In Solder Alloy Indalloy's #7, #10, #150, #204, #205 and #206 comprise a group of lead-indium solders designed to cover the temperature range of 165°C-275°C. All have the minimum gold-leaching characteristics.. |
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| CTE, linear | 26.0 µm/m-°C @Temperature 20.0 °C |
14.4 µin/in-°F @Temperature 68.0 °F |
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| Indium Corp. Indalloy® 206 Pb-In Solder Alloy Indalloy's #7, #10, #150, #204, #205 and #206 comprise a group of lead-indium solders designed to cover the temperature range of 165°C-275°C. All have the minimum gold-leaching characteristics.. |
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| CTE, linear | 26.0 µm/m-°C @Temperature 20.0 °C |
14.4 µin/in-°F @Temperature 68.0 °F |
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| Williams Advanced Alloys WS225 Solder All Williams alloys are available in a variety of shapes and forms, including ribbon, preforms, rod, ring, wire, and custom shapes.Information provided by Williams Advanced Alloys |
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| CTE, linear | 26.0 µm/m-°C @Temperature 20.0 °C |
14.4 µin/in-°F @Temperature 68.0 °F |
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| Williams Advanced Alloys WS292 Solder All Williams alloys are available in a variety of shapes and forms, including ribbon, preforms, rod, ring, wire, and custom shapes.Information provided by Williams Advanced Alloys |
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| CTE, linear | 26.0 µm/m-°C @Temperature 20.0 °C |
14.4 µin/in-°F @Temperature 68.0 °F |
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| Tra-Con Tra-Bond 2156 Heat Conductive Electrically Insulating Compound TRA-BOND 2156 is a thixotropic (smooth paste) thermally conductive epoxy system. It is used for staking heat sinks, transistors, diodes, resistor, integrated circuits and other heat-sensitive compon.. |
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| CTE, linear | 26.0 µm/m-°C @Temperature 20.0 °C |
14.4 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
| Covestro Baydur® STR/C-405 IMR Polyurethane Composite SRIM Foam, 45% Glass Filled, MDI-based 2-Component Liquid System Contains continuous strand fiberglass mat.0.118 in. thickness.Information provided by Bayer Corporation, Polyurethanes DivisionAs of 1 September 2015, Bayer MaterialScience was separated from Bayer .. |
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| CTE, linear | 26.0 µm/m-°C | 14.4 µin/in-°F | Below Tg |
| Epoxy Technology EPO-TEK® H20E-8 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-8 is a two component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is a higher viscos.. |
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| CTE, linear | 26.0 µm/m-°C | 14.4 µin/in-°F | Below Tg |
| Epoxy Technology EPO-TEK® H20E-LV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-LV is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is a .. |
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| CTE, linear | 26.0 µm/m-°C @Temperature 20.0 °C |
14.4 µin/in-°F @Temperature 68.0 °F |
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| AIM 80In/Pb15/Ag5 Solder for Photonic Packaging Uses include:Fiber to Ferrule SolderingLaser Die AttachHermetic Packaging & SealingWetting & Sealing Laser OpticsThermal ManagementInformation provided by AIM Specialty Materials. |
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| CTE, linear | 26.0 µm/m-°C @Temperature 20.0 °C |
14.4 µin/in-°F @Temperature 68.0 °F |
ISO 11359 |
| CENTROPLAST CENTROMID 6 GF 30 Polyamide 6 30% glass fiber The 30% glass fibre matrix adds very high strength and rigidity to this material. It has increased dimensional accuracy when hot. Can be used for rollers, belt pulleys and racks.Information provid.. |
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| CTE, linear | 26.0 µm/m-°C @Temperature 20.0 °C |
14.4 µin/in-°F @Temperature 68.0 °F |
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| AIM 40In/60Pb Solder for Photonic Packaging Uses include:Fiber to Ferrule SolderingLaser Die AttachHermetic Packaging & SealingWetting & Sealing Laser OpticsThermal ManagementInformation provided by AIM Specialty Materials. |
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| CTE, linear | 26.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
14.4 µin/in-°F @Temperature -22.0 - 86.0 °F |
ASTM D696 |
| Beijing Chemical Industry KAIFA® 304-G30 PBT Resin 30% glass fiber reinforced, flame retardant, low bleeding, UV-resistantInformation provided by Beijing Chemical Industry Research Institute (Group) |
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| CTE, linear | 26.0 - 34.0 µm/m-°C @Temperature 75.0 - 175 °C |
14.4 - 18.9 µin/in-°F @Temperature 167 - 347 °F |
Average value: 27.9 µm/m-°C Grade Count:1 |
| Overview of materials for Polyethersulfone, Carbon Fiber Reinforced This property data is a summary of similar materials in the MatWeb database for the category "Polyethersulfone, Carbon Fiber Reinforced". Each property range of values reported is minimum and maximu.. |
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| CTE, linear | 26.0 - 34.0 µm/m-°C @Thickness 2.00 - 4.00 mm |
14.4 - 18.9 µin/in-°F @Thickness 0.0787 - 0.157 in |
Average value: 27.9 µm/m-°C Grade Count:1 |
| Overview of materials for Polyethersulfone, Carbon Fiber Reinforced This property data is a summary of similar materials in the MatWeb database for the category "Polyethersulfone, Carbon Fiber Reinforced". Each property range of values reported is minimum and maximu.. |
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| CTE, linear | 26.0 µm/m-°C | 14.4 µin/in-°F | ISO 11359-2 |
| Polyplastic Armlen® PP GF 30-1EX Polypropylene Copolymer, 30% Glass Fiber Information provided by PolyPlastic Group. |
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| CTE, linear | 26.0 - 70.0 µm/m-°C | 14.4 - 38.9 µin/in-°F | Average value: 39.7 µm/m-°C Grade Count:26 |
| Overview of materials for Polypropylene with 30% Glass Fiber Filler This property data is a summary of similar materials in the MatWeb database for the category "Polypropylene with 30% Glass Fiber Filler". Specific grades with glass content between 25% and 34% are i.. |
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