Thermal Properties | Metric | English | Comments |
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Deflection Temperature at 8.0 MPa | 105 °C | 221 °F | ISO 75-2 |
Hexion Bakelite™ PF 13591 Phenolic Formaldehyde Resin, High Surface Quality, UL Listed
(discontinued **) Phenolic molding compound, mainly organically filled, very soft flow for large molds, UL listed molding compound 1.5 mm/V-1 (BK), 3.0 mm/V-0 (BK).Application areas: Pan handles, various applications.. |
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Deflection Temperature at 8.0 MPa | 105 °C | 221 °F | ISO 75-2 |
Hexion Bakelite™ PF 14600 Phenolic Formaldehyde Resin, High Surface Quality
(discontinued **) Phenolic molding compound, mainly organically filled, low specific gravity.Application areas: Cookware fittings, electric devices.Information provided by Bak AGBak AG became a part of Hexion in 2005.. |
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Deflection Temperature at 8.0 MPa | 105 °C | 221 °F | ISO 75-2 |
Hexion Bakelite™ PF 38110 Phenolic Formaldehyde Resin, High Surface Quality
(discontinued **) Phenolic molding compound, mainly organically filled.Application areas: Devices for the electrical installation, pan handles, knobs, mainly for compression molding.Information provided by Bak AGBak .. |
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Deflection Temperature at 8.0 MPa | 105 °C | 221 °F | ISO 75-2 |
Hexion Bakelite™ 460124 Phenolic Formaldehyde Resin
(discontinued **) Phenolic molding compound, mainly organically filled, standard molding compound for normal stress.Application areas: Cookware fittings, electric devices.Information provided by Bak AGBak AG became a.. |
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Deflection Temperature at 8.0 MPa | 105 °C | 221 °F | ISO 75-2 |
Hexion Bakelite™ X22 Phenolic Formaldehyde Resin, UL Listed
(discontinued **) Phenolic molding compound, mainly organically filled, UL listed molding compound 3.0 mm/V-0 (BN, BK).Application areas: Pot handles, operating controls, electrical isolators, housing parts.Informati.. |
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Deflection Temperature at 8.0 MPa | 105 °C | 221 °F | ISO 75-2 |
Hexion Bakelite™ X24 Phenolic Formaldehyde Resin
(discontinued **) Phenolic molding compound, mainly organically filled.Application areas: Operating controls, housing parts, lamp holders.Information provided by Bak AGBak AG became a part of Hexion in 2005. |
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Deflection Temperature at 8.0 MPa | 105 °C | 221 °F | ISO 75-2 |
Hexion Bakelite™ X30 Phenolic Formaldehyde Resin
(discontinued **) Phenolic molding compound, reinforced with cotton and sisal fibers, increased notched impact strength.Application areas: Covers for electrical and electromagnetic devices.Information provided by Bak.. |
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Deflection Temperature at 8.0 MPa | 105 - 160 °C | 221 - 320 °F | Average value: 131 °C Grade Count:18 |
Overview of materials for Nylon 12, 50% Glass Fiber Filled This property data is a summary of similar materials in the MatWeb database for the category "Nylon 12, 50% Glass Fiber Filled". Specific grades with glass content between 45% and 54% are included. .. |
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Deflection Temperature at 8.0 MPa | 105 °C | 221 °F | ISO 75-1/-2 |
EMS-Grivory Grivory® TRVX-50X9 black 9230 PAMACM12-GF50 Product description: Grilamid TRVX-50X9 is a 50% glass fiber reinforced amorphous polyamide. This product shows a very low tendency of distortion and is therefore especially suitable for complex and.. |
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Deflection Temperature at 8.0 MPa | 105 °C | 221 °F | ISO 75-1/-2 |
EMS-Grivory Grivory® TRVX-50X9 nat PAMACM12-GF50 Product description: Grilamid TRVX-50X9 is a 50% glass fiber reinforced amorphous polyamide. This product shows a very low tendency of distortion and is therefore especially suitable for complex and.. |