Thermal Properties | Metric | English | Comments |
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Glass Transition Temp, Tg | 30.0 °C | 86.0 °F | DSC; ASTM E1356-03 |
NeXolve White Optionox® Polyimide Film Highly UV durable with excellent weatherability and stability to ozone.Optinox® films and coatings are highly UV durable and exhibit excellent weathering durability, including very high stability .. |
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Glass Transition Temp, Tg | 30.0 - 220 °C | 86.0 - 428 °F | Average value: 108 °C Grade Count:22 |
Overview of materials for Epoxy, High Temperature This property data is a summary of similar materials in the MatWeb database for the category "Epoxy, Encapsulating, Mineral Filled". Each property range of values reported is minimum and maximum val.. |
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Glass Transition Temp, Tg | 30.0 °C | 86.0 °F | |
Mallard Creek Polymers ROVENE® 6014 Acrylic Emulsion Applications: Rovene® 6014 is a self crosslinking acrylic polymer providing a stiff hand to frothed or saturated substrates. Rovene® 6014 is recommended for various nonwoven and paper applicat.. |
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Glass Transition Temp, Tg | 30.0 °C | 86.0 °F | |
Mallard Creek Polymers Rovene® 6117 Acrylic Emulsion Applications: Rovene® 6117 is a clear drying, 100% acrylic, water resistant latex emulsion designed to provide protection for all types of concrete, cementitious and rigid surfaces. Rovene® 61.. |
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Glass Transition Temp, Tg | 30.0 °C | 86.0 °F | |
Lubrizol Estane® UB601 Thermoplastic Polyurethane Type: Estane® UB601 resin is a linear, hydroxyl terminated polyurethane polymer designed to be used as a binder for ink formulations. For ink applications, it gives high hardness to coated surface.. |
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Glass Transition Temp, Tg | 30.0 °C | 86.0 °F | |
Master Bond X17MED Elastomer Compound for Medical Device Applications Description: Master Bond Polymer System X17MED is a specially formulated one component adhesive specially designed for bonding polyolefins such as polypropylene and polyethylene as well as their man.. |
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Glass Transition Temp, Tg | 30.0 °C | 86.0 °F | |
Trelleborg Emerson & Cuming Stycast® 2850FT-FR/11 Two-Component Epoxy Flame Retardant Encapsulant Features and Typical ApplicationsProvide flame resistance down to 1/8 of an inch. These products also offer various other features such as thermal shock protection, low viscosity, and thermal conduc.. |
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Glass Transition Temp, Tg | >= 30.0 °C | >= 86.0 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
Epoxy Technology EPO-TEK® EJ2189 Electrically Conductive Epoxy Product Description: EPO-TEK® EJ2189 is an electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80°C, although othe.. |
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Glass Transition Temp, Tg | >= 30.0 °C | >= 86.0 °F | Post-Cure Dynamic Scan 20200°C; Ramp -40200°C @ 20°C/Min |
Epoxy Technology EPO-TEK® OG159-2 UV Cure Optical Epoxy Material Description: A single component, high viscosity, UV curable epoxy adhesive designed for sealing glass plates together in the LCD/OLED/display industry. It contains 1mil glass beads for bon.. |
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Glass Transition Temp, Tg | 30.0 °C | 86.0 °F | DAM; 10°C/min; ISO 11357-1/-2 |
DuPont Performance Polymers Zytel® RS LC2800 NC010 Nylon
(Unverified Data**) Plasticized Renewably Sourced Polyamide Developed for Extrusion Information provided by DuPont Performance Polymers |
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Glass Transition Temp, Tg | 30.0 °C | 86.0 °F | TM R050-25 |
Resinlab® EP1282 Clear Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP1282 Clear is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It is recognized under the Component Recognition Program of Underwriters Laborat.. |
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Glass Transition Temp, Tg | 30.0 °C | 86.0 °F | TM R050-25 |
Resinlab® EP1282 Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP1282 Black is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It is recognized under the Component Recognition Program of Underwriters Laborat.. |